1992
DOI: 10.4028/www.scientific.net/ssp.25-26.143
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Microhomogeneity and Sintering of W-Cu Composite Powders Produced by Hydrogen Reduction

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Cited by 16 publications
(6 citation statements)
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“…Figure 2 shows the thermo-gravimetric(TG) results of the ball-milled WO 3 and CuO powder mixture. It can be seen that, with increasing temperature, the weight losses of the powder mixture show stepwise behavior approximately divided into three plateau regions, which is basically in accordance with previous investigation [4]. The reduction reaction of CuO to Cu mainly occurs at the temperature around 250 °C and almost completes below 300 °C.…”
Section: Resultssupporting
confidence: 90%
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“…Figure 2 shows the thermo-gravimetric(TG) results of the ball-milled WO 3 and CuO powder mixture. It can be seen that, with increasing temperature, the weight losses of the powder mixture show stepwise behavior approximately divided into three plateau regions, which is basically in accordance with previous investigation [4]. The reduction reaction of CuO to Cu mainly occurs at the temperature around 250 °C and almost completes below 300 °C.…”
Section: Resultssupporting
confidence: 90%
“…The enhancement of densification has been accomplished by forming fine W-Cu composite powder through mechanical alloying of the elemental powders or hydrogen reduction of W and Cu oxides [3,4]. The formation of fine W-Cu composite powder contributes to densification through enhancing particle re-arrangement process and/or increasing solubility of W in Cu during liquid phase sintering.…”
Section: Introductionmentioning
confidence: 99%
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“…Hence, many researches have been carried out on the development of synthesis methods for nano metal powders, such as sol-gel, co-precipiation, and mechanical alloying (MA) [2,3]. Recently, Lee and his co-workers reported on the successful fabrications of nano metal alloy and composite powders by hydrogen reduction of ball-milled metal oxide nanopowders [4,5]. In spite of the processing advantage, however, thermal process of hydrogen reduction inevitably accompanies grain growth during the process at elevated temperatures.…”
Section: Introductionmentioning
confidence: 99%
“…W-Cu pseudo-alloy possesses potential for applications such as a contact of high power electricity and heat sink of micro-electronic package because of its high electrical and thermal conductivities and low thermal expansion coefficient [1,2]. Moreover, W-Cu pseudo-alloy has been focused as one of promising materials for a shaped charge liner in military field, due to its high density and excellent elongation in high strain rate [3,4].…”
Section: Introductionmentioning
confidence: 99%