2021
DOI: 10.1016/j.matdes.2021.110114
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Micromachining of Al2O3 thin films via laser drilling and plasma etching for interfacing copper

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Cited by 5 publications
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“…However, relevant researches are only focused on the case of single defect. Moreover, as the MEMS (Micro-Electro-Mechanical System) highly developed into nano-scale, the group of surface pit defects is becoming a common practice in the bulk micromachining [ 16 , 17 , 18 , 19 ], especially in the dry etching field [ 20 , 21 ]. So it is in great significance to simulate the thin film with surface multi-defects; however, relevant investigations on this aspect are still rare to see.…”
Section: Introductionmentioning
confidence: 99%
“…However, relevant researches are only focused on the case of single defect. Moreover, as the MEMS (Micro-Electro-Mechanical System) highly developed into nano-scale, the group of surface pit defects is becoming a common practice in the bulk micromachining [ 16 , 17 , 18 , 19 ], especially in the dry etching field [ 20 , 21 ]. So it is in great significance to simulate the thin film with surface multi-defects; however, relevant investigations on this aspect are still rare to see.…”
Section: Introductionmentioning
confidence: 99%