2013
DOI: 10.1149/2.006402jes
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Micromolding of NiFe and Ni Thick Films for 3D Integration of MEMS

Abstract: Electrodeposition process was studied in order to obtain uniformly thick magnetic films which could be incorporated in magnetic microsensors and actuators. Ni and NiFe patterns of different dimensions were deposited by micromolding on a Cu/Ti seed layer sputtered on SiO 2 /Si (for NiFe) and glass (for Ni). In the case of NiFe deposit, a linear deposition rate was calculated by measuring the deposit thickness using mechanical profilometry. The optimum pattern composition for the fabrication of magnetic microdev… Show more

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Cited by 9 publications
(8 citation statements)
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“…Theoretical background.-The anomalous codeposition phenomenon known as a ,,volcano" type curve-with a maximum in Fecontent in NiFe as a function of the applied potential or current densitywas observed in the literature for the thin NiFe films [32][33][34] and NiFe nanowires. 20 The observed results were explained through the limited mass transport of Fe +2 ions after the peak.…”
Section: Resultsmentioning
confidence: 99%
“…Theoretical background.-The anomalous codeposition phenomenon known as a ,,volcano" type curve-with a maximum in Fecontent in NiFe as a function of the applied potential or current densitywas observed in the literature for the thin NiFe films [32][33][34] and NiFe nanowires. 20 The observed results were explained through the limited mass transport of Fe +2 ions after the peak.…”
Section: Resultsmentioning
confidence: 99%
“…The electrodeposition and micromolding process of copper and Ni-Fe have been previously detailed. 17 In the present work, DC electrodeposition with a current density of −20 mA/cm 2 has been used for Cu, and pulsed positive/negative electrodeposition with cathodic and anodic current densities (resp. pulse times) of −10 mA/cm 2 and 22.5 mA/cm 2 (resp.…”
Section: Methodsmentioning
confidence: 99%
“…C v,0 can be estimated from both mechanical and electrical results with (21) or from electrical results only with (23). Comparing C v,0 obtained from these two equations show the good consistency of the mechanical and electrical characteristics.…”
Section: Electrical Resultsmentioning
confidence: 85%
“…From the estimated gap, it becomes possible to compute C v,0 based on (6). C v,0 was also estimated from (23).…”
Section: Electrical Resultsmentioning
confidence: 99%
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