2015
DOI: 10.1007/s10854-015-3628-5
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Micromorphology characterization of copper thin films by AFM and fractal analysis

Abstract: In this study, Cu thin films with layer thicknesses of 5, 25, and 50 nm were prepared by DC magnetron-sputtering method and their three dimensional (3-D) surface topography were investigated. Concretely, the 3-D surface roughness of samples was studied by atomic force microscopy (AFM), fractal analysis of the 3-D AFM-images and power spectral density (PSD) function. Also the content of thin films was characterized by X-ray diffraction (XRD). The thin films were prepared onto glass and p-type silicon (100) subs… Show more

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Cited by 80 publications
(47 citation statements)
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“…These methods play a significant part in electronics and optoelectronics and are prevalent in industrial and scientific areas [14][15][16][17]. The controlling factor of performance is the surface condition of the substrate.…”
Section: Resultsmentioning
confidence: 99%
“…These methods play a significant part in electronics and optoelectronics and are prevalent in industrial and scientific areas [14][15][16][17]. The controlling factor of performance is the surface condition of the substrate.…”
Section: Resultsmentioning
confidence: 99%
“…Despite the fact that SPM is a technique of microscopy, the fact is that we can obtain a huge range of surface data [10][11][12][13][14][15][16][17][18]. In this regard, the methods of analyzing and interpreting the obtained results are of essential [19][20][21][22][23].…”
Section: Organization Of the Study Processmentioning
confidence: 99%
“…Composite thin films combining electrically conductive and dielectric phases, and/or magnetic and non-magnetic materials have attracted considerable attention during several decades in high-tech industries due to their tailored physical properties and their applications in ferroelectronic memories, electronic devices and spintronics [1][2][3][4][5][6][7]. In these materials, interesting physical behaviors arising from surface and confinement effects are expected, and their understanding requires a proper characterization of the film surface roughness using quantitative descriptions [8][9][10][11][12][13].…”
Section: Introductionmentioning
confidence: 99%
“…In this regards, in modern manufacturing processes, two approaches are mainly used for the analysis of 3-D surface topography: statistical and fractal methods [1,5,[9][10][11][12][13][14][15][16]. Given the complex surface topography of nano-and microstructures, it cannot be completely characterized only by using the traditional Euclidean geometry; therefore, the use of fractal geometry is more convenient for surface roughness analyses of such systems [1,5,[9][10][11][12][13][14][15][16].…”
Section: Introductionmentioning
confidence: 99%
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