Micron-Level Actuators for Thermal Management of Microelectronic Devices

Erbas, N.; Baysal, Oktay

doi:10.1080/01457630802293662

Cited by 17 publications

(7 citation statements)

References 11 publications

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“…In a recent study, Erbas and Baysal [16] conducted computational work of a synthetic jet actuator in a two-dimensional channel to assess its thermal effectiveness on a heated surface protruding into the fluid as a step. They varied the number of actuators, placement and phasing of the membrane concluding that the heat transfer rate would increase with the number of jets, appropriate jet spacing, the use of nozzle-type orifice geometry and 180 out of phase jet operation.…”

Section: Introductionmentioning

confidence: 99%

Heat transfer enhancement in microchannels with cross-flow synthetic jets

Chandratilleke

Jagannatha

Narayanaswamy

2010

International Journal of Thermal Sciences

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Section: Introductionmentioning

confidence: 99%

Heat transfer enhancement in microchannels with cross-flow synthetic jets

Chandratilleke

Jagannatha

Narayanaswamy

2010

International Journal of Thermal Sciences

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“…Dynamics of liquids confined by solid walls has been studied for several decades. − Due to the different characteristics of a liquid on a solid wall and bulk liquid, the importance of understanding the fluidic motion at the solid–liquid boundary has been acknowledged in the fields of biology, microelectronics, nanoscale electromechanical systems, and lab-on-a-chip devices, to name a few. − From the microscopic point of view, transport phenomena are significantly affected by the intermolecular interactions at the solid–liquid interface, , which promotes many studies on the chemophysical properties of the fluid at the molecular level to fundamentally understand the transport phenomena in the solid–liquid interfacial region.…”

Section: Introductionmentioning

confidence: 99%

Water Slippage on Graphitic and Metallic Surfaces: Impact of the Surface Packing Structure and Electron Density Tail

et al. 2020

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While fluid flow at solid−liquid interfaces has been of great interest, studying its behavior is challenging because it requires a comprehensive understanding of the complex interactions that exist at various realistic solid−liquid interfaces. In particular, the slip phenomenon had been a debated subject for decades before the phenomenon was proven at a molecular level. Since the slip behavior is widely acknowledged, its fundamental relationships with other measurable physical properties have been studied intensively. Here, we present a first-principles-based multiscale simulation study on various solid−water interfacial systems to understand how the physical quantities influence the slip length. Based on the simulation results, we propose an extended quasi-universal relationship between the slip length and the work of adhesion by considering the surface packing density. Furthermore, we scrutinize the effects of the electron density tail from the solid wall on both the slip length and work of adhesion. We also investigate the relationship between the self-diffusivity of the fluid at the interface and the slip length. Our present study underlines the impact of atomic-level details of the solid−liquid interfaces, such as the surface packing structure and electrostatic interactions, on determining the hydrodynamic boundary conditions.

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“…The various cooling methods investigated so far include changing the shape of the channel, increasing surface roughness, creating cavities on the walls and using nanofluids in the base fluid. Air cooling is favored because of its simple design, but is usually limited to low heat-fluxing systems [2]. However, liquid-cooling systems are preferred in high heat-fluxing systems due to their high convection rate, but their design complexity and cost are increased compared to air-cooled systems [3].…”

Section: Introductionmentioning

confidence: 99%

Performance Comparison of Mini-Rectangular Fin Heat Sinks Using Different Coolants: Supercritical CO2, Water and Al2O3/H2O Nanofluid

et al. 2022

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Mini-channel heatsinks have proven useful in removing high heat fluxes from microelectronic devices. However, further miniaturization of electronic devices requires significant enhancement in the mini-channel heatsinks’ thermohydraulic characteristics, which depend greatly on the coolant and geometrical configuration of the channel. Therefore, the current study explores the potential of mini-channel heatsinks’ using different coolants (water, nanofluid and supercritical carbon dioxide) and various channel configurations. The effect of various channel configurations on the thermohydraulic characteristics of the mini-channel heat sinks is evaluated numerically for different coolants employing three flow rates (17 g/s, 34 g/s and 50 g/s). Hence, the effects of fin height, spacing and thickness, and mass flow rate on the overall heat transfer coefficient (CHT) and pressure drop (ΔP) are reported for the abovementioned coolants. It is found that increasing the mass flow rate increases both the CHT and ΔP. It is also noted that increasing the fin height and spacing decreases both the CHT and ΔP, as opposed to increasing the thickness, which causes both the CHT and ΔP to increase. Among the three coolants used, the sCO2 shows superior performance compared to the water and nanofluid and this based on higher CHT and lower ΔP. Moreover, the performance evaluation criterion (PEC) for the sCO2 is higher than that for the water and nanofluid by 53% at 17 g/s flow rate and 243% at 50 g/s flow rate.

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Micron-Level Actuators for Thermal Management of Microelectronic Devices

Cited by 17 publications

References 11 publications

Heat transfer enhancement in microchannels with cross-flow synthetic jets

Heat transfer enhancement in microchannels with cross-flow synthetic jets

Water Slippage on Graphitic and Metallic Surfaces: Impact of the Surface Packing Structure and Electron Density Tail

Performance Comparison of Mini-Rectangular Fin Heat Sinks Using Different Coolants: Supercritical CO2, Water and Al2O3/H2O Nanofluid

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