We previously showed that microparts can be fed along a saw-toothed surface using simple planar symmetric vibrations. Microparts move forward because they adhere to the saw-toothed surface asymmetrically. Using saw-toothed silicon wafers fabricated by a dicing saw applying bevel type blades, we evaluated the principle of unidirectional feeding of 2012type capacitors (size, 2.0 × 1.2 × 0.6 mm: weight, 7.5 mg) and 0603-type capacitors (size: 0.6 × 0.3 × 0.3 mm, weight: 0.3 mg), by analysing the contact between these feeder surfaces and a spherical model of convexities on the electrode surfaces of these capacitors. To extend these findings, we analysed the contact between capacitors and the saw-tooth surface using direct measurements. Surface profiles of the feeder surfaces and 0603-type capacitors were measured microscopically. Picture analysing software was applied to obtain a numerical model of these surface profiles. By processing the numerical model, we calculated a linear polynomial that approximated the surface profile. An adhesion model was examined by analysing the contact between these approximated models. Finally, using this adhesion model, we formulated a model for the driving force of microparts.