Microreplicated CMP pad for RMG and MOL metallization

Tseng, Wei–Tsu; Wu, Changhong; Hagan, J. T.; Wang, Yanni; Lin, Hong; Han, Ja-Hyung; Koli, Dinesh

doi:10.1109/iitc-amc.2017.7968954

2017 IEEE International Interconnect Technology Conference (IITC) 2017

DOI: 10.1109/iitc-amc.2017.7968954

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Microreplicated CMP pad for RMG and MOL metallization

Wei–Tsu Tseng

Changhong Wu

J. T. Hagan

et al.

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2021

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“…Recently CMP pads with microreplicated surface features or asperities have been introduced for advanced process nodes and the precise nature of these features affords a higher degree of control and range of input pad parameters for design of experiments. 6,7 Measurement of nanoparticles for advance CMP process development.-Advanced node CMP presents several new challenges, such as material selectivity, extreme dishing and erosion control, and heightened defect sensitivity. 8 Previous studies have analyzed CMP effluent and have associated large particle counts (LPC) and pad debris with CMP wafer defect performance.…”

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confidence: 99%

Single Particle Inductively Coupled Plasma Mass Spectrometry Study of Ceria Nanoparticle Size Distribution from Oxide CMP with Microreplicated Pads

Zazzera¹,

Chan²,

Stomberg³

et al. 2021

ECS J. Solid State Sci. Technol.

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This work describes the use of Single Particle Inductively Coupled Plasma Mass Spectrometry (spICP-MS) to measure ceria particle number concentrations and compare changes in size distributions to silicon dioxide wafer removal rates from different chemical mechanical planarization (CMP) processes. Particle number concentrations were measured for the 21 to 559 nm size range at 1 nm size resolution. Changes in the ceria particle size distribution after CMP included a decrease in large (>130 nm) particles, an increase in small (<40 nm) particles, an increase in the total number of particles, and a decrease in median particle size. The decrease in median size was as high as 7% and influenced by flow rate, pressure and pad type. A novel microreplicated CMP pad was used which requires no pad conditioning to ensure consistent pad surface features, and the effect of different pad types on removal rate and particle size was isolated. A decrease in the median particle size correlated with higher silicon dioxide removal rates (R2 = 0.96) for a series of pad types with unique combinations of chemistry and surface features. This new combination of nano particle metrology and control of pad surface features is an innovative tool set for modeling advanced CMP processes.

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confidence: 99%

Single Particle Inductively Coupled Plasma Mass Spectrometry Study of Ceria Nanoparticle Size Distribution from Oxide CMP with Microreplicated Pads

Zazzera¹,

Chan²,

Stomberg³

et al. 2021

ECS J. Solid State Sci. Technol.

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Microreplicated CMP pad for RMG and MOL metallization

Cited by 1 publication

References 3 publications

Single Particle Inductively Coupled Plasma Mass Spectrometry Study of Ceria Nanoparticle Size Distribution from Oxide CMP with Microreplicated Pads

Single Particle Inductively Coupled Plasma Mass Spectrometry Study of Ceria Nanoparticle Size Distribution from Oxide CMP with Microreplicated Pads

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