The synergistic impact of deposition temperature conditions
for
the InGaZnO (IGZO) and gate insulator (GI) layers during the thermal
atomic-layer deposition process on the device performance and operational
reliability was examined for the top-gate thin-film transistors (TFTs).
The Ga increased with an increase in the channel deposition temperature
and did not change significantly following the GI deposition process.
Prior to the postannealing process, the transfer characteristics of
the devices were predominantly influenced by the GI deposition temperature.
Following the postannealing process, however, the thermal stability
was affected by both the deposition temperatures of the channel and
GI layers. An increase in the GI deposition temperature from 200 to
300 °C resulted in an improvement in the IGZO channel quality,
accompanied by a reduction in the hydrogen concentration of the GI.
These results indicated that the device, wherein GI was prepared at
300 °C, was appropriate from both perspectives of performance
and subsequent postannealing. Nevertheless, only Dev-HD, in which
the channel and GI layers were prepared at 270 and 300 °C, respectively,
demonstrated favorable thermal stability after a postannealing at
300 °C. Two potential effects may be the formation of a complete
network and the content of Ga, which contribute to stable bonding
in IGZO channel. It can thus be concluded that the IGZO network structure
and cationic composition can be adjusted to control the defect states
in the channel, leading to an enhancement in both the device performance
and thermal stability of the TG IGZO TFTs.