Microstructology of solid-state reactions

Markovski, SL Slobodan; Dal, van Mjh Mark; Verbeek, Marco; Kodentsov, AA Alexander; Loo, van Fjj Frans

doi:10.1361/105497199770340905

Cited by 18 publications

(11 citation statements)

References 27 publications

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“…There are several publications regarding solid-state reaction between chromium or other transition metals and SiC at temperatures [1000°C [22][23][24][25][26][27][28][29][30][31]. However, the author of the present article is not aware of any publication regarding the influence of the chromium content on the tribological performance of steel/SiC couples under dry sliding conditions.…”

Section: Wear Behaviourmentioning

confidence: 96%

“…Consequently, SiC can be considered as reaction partner for further chemical reactions. Therefore, reaction products or the diffusion path respectively were neglecting possible reactions with iron and nickel, presumably as described in [28]: SiC-Cr 5 Si 3 C x -Cr 3 Si-Cr 7 C 3 -Cr 23 C 6 . The diffusion path can be derived from the ternary Fig.…”

Section: Wear Behaviourmentioning

confidence: 99%

“…For the couple EKasicF/C45E: formation of a metallic third body layer (A) and (granular) fracture of the EKasicF (B) Fig. 11 a Ternary phase diagram for system Cr-Si-C at 1125°C and b corresponding activity diagram taken from [28] Tribol Lett (2011) 44:247-257 255 phase diagram and activity diagrams shown in Fig. 11.…”

Section: Wear Behaviourmentioning

confidence: 99%

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On the Tribological Behaviour of SiC and Alumina Mated Against Different Steels Under Dry Sliding Conditions

Wallstabe

2011

Tribol Lett

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There have been several studies regarding the tribological behaviour of ceramics such as SiC and alumina mated against steels or self-mated. Nevertheless, only little is known about possible tribochemical reactions when ceramics are mated against steels. In the present study, ceramic pins made of SiC (EKasicF) or alumina (F99.7) respectively were tested under dry sliding conditions against different steel disc counter bodies using a pin-ondisc tribometer. The different ceramics showed significant differences in their tribological behaviour, i.e., coefficient of friction and wear amount. Especially, the SiC couples showed significant differences in the wear amounts while these were quite similar for the alumina couples. The wear behaviour of the SiC couples is discussed in more detail. A correlation between chromium content of the steel discs was found for the SiC couples. The surfaces of selected specimens were analysed by Auger-Electron-Spectroscopy (AES). Wear for the SiC couples was mainly attributed to tribochemical reactions as far as the steel disc was containing the alloying element chromium in considerable amount. Furthermore, a simple wear schematic is proposed.

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Section: Wear Behaviourmentioning

confidence: 96%

Section: Wear Behaviourmentioning

confidence: 99%

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On the Tribological Behaviour of SiC and Alumina Mated Against Different Steels Under Dry Sliding Conditions

Wallstabe

2011

Tribol Lett

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“…In particular, the distribution patterns of C-aggregation and distribution as single or combined random, modulate, alternating layers [30,31,33] with varied thicknesses are resulting from a balance of interdiffusion kinetics, rate of SiC-decomposition, rejection of unreacted C, nucleation and growth kinetics of silicides phase [30][31][32][33][34]. Specifically, C-precipitates with a periodic morphology were detected in the reaction zone of SiC/Ni [30-32, 34, 45] and SiC/Pt [30,33,34,46]. Contrary, C-precipitates with different sizes and scattered distribution, were generated in the case of the SiC/Co [34,46,47] and SiC/Fe [30,31,34] reaction zones.…”

Section: C-precipitation and Morphological Rearrangementmentioning

confidence: 99%

Solid state reactions between SiC and Ir

Camarano

Narciso

Giuranno

2019

Journal of the European Ceramic Society

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Reactivity between SiC and Ir as a function of SiC-crystallinity was investigated by diffusion bonding technique under a vacuum and over the temperature range of 1200-1450°C. As reaction products, various Irsilicides and free unreacted-C were detected. Reactivity is strongly affected by the temperature and SiCcrystallinity involving a series of interactions, from "no reaction" to "massive exothermic reactions". In particular, interfacial phenomena are more pronounced by the presence of defects and grain boundaries.Solid state reactions result in formation of fine C-precipitates rearranged in a quasi-periodic microstructure.On the contrary, clustering of highly ordered C-precipitates (C-graphitized) occurs after "massive reactions" take place.A relationship between the degree of graphitization (from 1 to multi-layers of graphene), temperature and SiC crystallinity was found by Raman spectroscopy. 2D-layering phenomenon is enhanced in polycrystalline SiC at high temperature.

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“…However, after 6000 h aging, the IMC layer in the Sn-Zn-1Nd soldered joint presented a collapsed and separating structure, while massive Cu 5 Zn 8 IMC pieces could be found in the solder matrix as shown in Figure 3b. According to the theory of diffusion in solid [19,20], the formation of this periodic layer is related to the stresses induced by the different growth rate of diffusion couples in the interface layer. When the elastic deformation of the slow-growing diffusion couple reaches its limit value, it will be split up through the diffusion direction which cause the disintegration of the IMC layer.…”

Section: Introductionmentioning

confidence: 99%

Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints

Xue

Liang

et al. 2019

Applied Sciences

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The tin whisker inhibition in RE-doped Sn-Zn soldered joints was investigated. The results indicated that after aging treatment at 150 • C, with the proper addition ratio of Ga and Nd, no obvious NdSn 3 phase nor tin whisker growth was observed in the soldered joints. By replacing the Sn-Nd phase with a Ga-Nd phase, the risk of tin whisker growth caused by the oxidation of RE-phase was significantly inhibited even in soldered joints with additional excessive contents of Nd. The IMC layer in soldered joints with optimal addition showed a relatively regular shape after aging treatment, making the soldered joint maintain preferable mechanical performance. The results would be available for guiding the study of tin whisker growth inhibition method.bearing rare earth Nd were investigated. The results could provide a feasible method to inhibit tin whisker growth, and the method has been successfully tested over a long time aging treatment. Experimental ProcedureAll alloys were made from pure Sn (99.95 wt.%), pure Zn (99.95 wt.%), pure Ga (99.95 wt.%), and pure Nd (99.5 wt.%). Under vacuum atmosphere (10-3 torr), Sn-5Nd master alloy ingots were prepared by melting Sn and Nd at 90 • C for 15 min. Then the master alloy was added into the melted SnZn alloy which was held for about 5 min while mechanical stirring was performed every 1 min. The melting temperature was controlled below 400 • C. The melted solder was chilled to cast and cut into solder bars of 40 mm length. The compositions of alloys were analyzed by inductively coupled plasma emission spectrometer (ICP-AES).The interfacial microstructure of soldered joints after aging treatment were observed by Su8010 field emission scanning electron microscope (FE-SEM, BSE mode, Hitachi Co., Ltd., Tykyo, Japan) equipped with energy dispersive X-ray spectroscopy (EDS). Phase composition analysis was determined through Rigaku ultima IV x-ray diffractometer (XRD) with following parameters: Cu-Kα target, working voltage 40 kV, operating current 40 mA, scanning speed 5 • /min, and scanning range 20 • to 100 • .According to the Japan Industry Standard JIS Z 3198-2 test methods for lead-free solders-Part7

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Microstructology of solid-state reactions

Cited by 18 publications

References 27 publications

On the Tribological Behaviour of SiC and Alumina Mated Against Different Steels Under Dry Sliding Conditions

On the Tribological Behaviour of SiC and Alumina Mated Against Different Steels Under Dry Sliding Conditions

Solid state reactions between SiC and Ir

Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints

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