Microstructural and creep characterization of Sn-0.7Cu and Sn-0.7Cu-xBi lead-free solders for low cost electronic

Alsowidy, Shakib; Aljarbani, Ahmed M.; Gumaan, Mohammed S.

doi:10.1016/j.rinma.2022.100319

Cited by 7 publications

(2 citation statements)

References 26 publications

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“…Secondly, all samples were polished using grades of silicon paper and then washed in a solution of (CH3COOH3), after that, the samples were drawn using the rolling mechanism technique; the first group was as wires of a diameter (D=1mm) and a length (L=70Cm) for Creep properties, Finally, the samples were washed again in a solution of (CH3COOH3) in order to remove residual stress and defects induced during specimen formation [12,13,14].…”

Section: Methodsmentioning

confidence: 99%

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Al-Hammadi,

Loqman,

AL-Hdhrami

2023

jast

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Research on Material Science has a long tradition, and lead has been used widely in many applications. Because of their low melting temperatures, low cost, and good wettability, tin -lead alloys have been preferred as solder alloys in industrial production, particularly in the electronics sector. However, due to the negative effects of lead on the environment and human health, studies on lead-free solder alloys have been increasing, and the subject is still important today. Furthermore, environmental protection agencies (RoHS and WEEE) have prohibited the use of lead-containing solder alloys in the manufacture of electronic and microelectronic products. In this work, the effect of adding Cu to alloys in five compositions of (81Sn-xCu-(19-x)In) % with x=1, 2, 3, 4, and 5 on the mechanical properties has been studied. The five samples were prepared from high purity (99%) elements (Sn –Cu –In ) using the melting technique. The creep of the ternary alloys was examined at different temperatures (25, 50, and 80 ) under three different loads (2.5, 6.3, and 11.4 MPa). It was found that the creep rate of the ternary alloys was increasing with the increases in Cu –content in all samples at different temperatures and loads. The mean values of the stress exponent were found to be in the range of (0.1-2.5) as well as the activation energies vaied in the range of (0.48-5.33) eV for all alloys under different loads (2.5, 6.3, and 11.4 MPa).

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Section: Methodsmentioning

confidence: 99%

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Al-Hammadi,

Loqman,

AL-Hdhrami

2023

jast

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“…Previous studies have contributed significantly by proposing new Sn-based alloys as potential alternatives to Sn-Pb alloys [10][11][12][13]. Particularly, the Sn-Ag, Sn-Ag-Cu, and Sn-Cu [wt.%] alloys seem to be the most promising choices for mechanical strength and electrical properties [14][15][16]. In recent years, the addition of Mg has emerged as a promising strategy to enhance the performance of these alloys.…”

Section: Introductionmentioning

confidence: 99%

The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy

Cruz,

Soares,

Barros

et al. 2023

Metals

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Sn-Mg alloys are potential Pb-free solder options. However, their mechanical strength and interfacial characteristics with electronic substrates remain barely understood. This study focuses on the interfacial heat transfer aspects, microstructure, and tensile strength of a Sn-2.1wt.%Mg alloy. Samples with various thermal histories were produced using a directional solidification apparatus. In these experiments, a Sn-2.1wt.%Mg alloy was solidified on Cu and Ni substrates, which are of interest in the electronics industry. Mathematical modeling was then employed, allowing for the determination of the overall and interfacial heat transfer coefficients (hov, and hi, respectively). The results show that the Ni substrate exhibits higher interfacial thermal conductance with the Sn-2.1wt.%Mg alloy compared to the Cu substrate, as indicated by the higher hi profiles. This fact occurs mainly due to their metallurgical interaction, resulting in a stronger bond with the presence of Sn-Ni-rich intermetallics at the interface. Finally, experimental equations based on the Hall–Petch relationship are proposed to describe how the refinement of the fibrous spacing of the Mg2Sn interphase (λG) and an increase in hi enhance both yield and ultimate tensile strengths.

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Impact of Cr³⁺/Mo⁶⁺/W⁶⁺ Doping on Dipolar Relaxation and AC Conductivity in Li₂O–Al₂O₃–SiO₂ Glasses

Vijaya Krishna,

Pavić,

Bafti

et al. 2024

Physica Status Solidi (a)

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In this investigation, results of dielectric features of Li2O–Al2O3–SiO2 (LAS) glass doped with 3.0 mol% of Cr2O3, MoO3, and WO3 are presented. The investigation spans broad regions of frequency (ω) 10−2–106 Hz and temperature (T) 20–240 °C. Initial characterization of the samples by means of optical absorption spectra reveals that Cr ions do persist in Cr3+oxidation state, whereas fractions of Mo and W ions do present in Mo5+ and W5+ states in addition to predominant presence Mo6+ and W6 + ions, respectively. Infrared spectra suggest that Mo5+ and W5+ ions involve in modifying the network of the glass and induced structural disorder. Dielectric parameters and also σac are observed to be the largest for 40Li2O–5Al2O3–52SiO2:3.0 MoO3 (LASMo) glass followed by 40Li2O–5Al2O3–52SiO2:3.0 WO3 (LASW) and 40Li2O–5Al2O3–52SiO2:3.0 Cr2O3 (LASCr) glasses. Analysis of dipolar relaxation phenomena are carried out using Cole–Cole plots. Analysis of the results of σac suggests that polaronic conduction due to electron transfer between Mo5+ ↔ Mo6+ and W5+ ↔ W6+ is prevailed in case of LASMo and LASW glasses and these glasses are predicted to be useful as cathodes, whereas in LASCr glass, ionic conductivity is dominant and is suitable for electrolytes in ionic batteries.

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Microstructural and creep characterization of Sn-0.7Cu and Sn-0.7Cu-xBi lead-free solders for low cost electronic

Cited by 7 publications

References 26 publications

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy

Impact of Cr³⁺/Mo⁶⁺/W⁶⁺ Doping on Dipolar Relaxation and AC Conductivity in Li₂O–Al₂O₃–SiO₂ Glasses

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Microstructural and creep characterization of Sn-0.7Cu and Sn-0.7Cu-xBi lead-free solders for low cost electronic

Cited by 7 publications

References 26 publications

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy

Impact of Cr3+/Mo6+/W6+ Doping on Dipolar Relaxation and AC Conductivity in Li2O–Al2O3–SiO2 Glasses

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Impact of Cr³⁺/Mo⁶⁺/W⁶⁺ Doping on Dipolar Relaxation and AC Conductivity in Li₂O–Al₂O₃–SiO₂ Glasses