Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

Shalaby, Rizk Mostafa; Kamal, Mustafa; Ali, Esmail Abdo Mohammed; Gumaan, Mohammed S.

doi:10.1016/j.msea.2017.03.022

Cited by 42 publications

(4 citation statements)

References 21 publications

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“…To analyze the microstructure, a scanning electron microscope (SEM) of the type (JEOL JSM-6510 LV, Japan) which operated at 30 kV with a high resolution of 3 nm was used (Shalaby et al , 2007). Differential scanning calorimetry (DSC) was used to determine the melting temperature of these alloys at a heating rate of 10 K/min (Mostafa Shalaby et al , 2017). A dynamic resonance method was used to investigate the mechanical properties in air (Schreiber et al , 1974).…”

Section: Methodsmentioning

confidence: 99%

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Effect of TiO₂ nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy

Al-sorory

Gumaan

Shalaby

2022

SSMT

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Purpose This study aims to investigate the effect of a small amount of TiO2 NPs addition on the microstructure, thermal, mechanical and electrical properties of environmentally friendly eutectic (SAC355)100-x(TiO2)x (x = 0.1, 0.3, 0.5, 0.7 and 1 wt.%) solder alloys. Design/methodology/approach Mechanical, thermal and electrical properties and microstructure conditions are taken into major consideration in any study of materials containing nanoparticles. Dynamic resonance technique, X-ray diffraction and scanning electron microscopy were carried out to study stiffness, identification of the phases and the morphology features of the solder. Structure and microstructure analysis indicated that the presence of rhombohedral β–Sn phase in addition to orthorhombic intermetallic compound (IMC) Ag3Sn and Cu3Sn phase dispersed in Sn matrix. In addition, the results showed that TiO2 NPs addition at a small trace amount into SAC355 system reduces and improves the particle size of both rhombohedral β–Sn and orthorhombic IMC Ag3Sn and Cu3Sn. The interstitial dispersion of TiO2 NPs at grain boundaries resulted in Ag3Sn being more uniform needle-like, which is distributed in the β–Sn matrix. The fine and uniform microstructure leads to improvement of mechanical strength. Findings Some important conclusions are summarized as follows: microstructure investigations revealed that the addition of TiO2 NPs particles to eutectic SAC355 inhibited in reducing and refines the crystallite size as well as the Ag3Sn IMC, which reinforced the strength of plain solder alloy. The mechanical properties values such as Young’s modulus and Vickers microhardness of SAC355 solder alloy can be significantly improved by adding a trace amount of TiO2 NPs compared with plain solder because of the existence of appropriate volume fraction of Ag3Sn IMC. The results show that the best creep resistance is obtained when the addition of 0.3 wt.% of TiO2 NPs is compared to plain solder. TiO2 NPs addition could increase the melting temperature, compared with plain solder. All results showed that TiO2 NPs addition is an effective method to enhance new solder joints. Practical implications New solder alloys. Originality/value Development of TiO2 NPs-doped eutectic SAC355 lead-free solder for electronic packaging.

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Section: Methodsmentioning

confidence: 99%

“…The mechanical behaviour of these alloys was investigated using a modified DRT. The following empirical equations were used to calculate the dynamic elastic modulus, E , and internal friction, Q −1 (Mostafa Shalaby et al , 2017): …”

Section: Mechanical Propertiesmentioning

confidence: 99%

Effect of TiO₂ nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy

Al-sorory

Gumaan

Shalaby

2022

SSMT

Self Cite

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“…A modified DRT was used to investigate the mechanical behaviour of these alloys. The empirical equations listed below were used to calculate the dynamic elastic modulus, E , and the internal friction, Q −1 (Mostafa Shalaby et al , 2017): …”

Section: Resultsmentioning

confidence: 99%

“…The hardness (Hv) and creep indentation of all melt-spun solders were investigated using a digital Vickers microhardness tester (type-FM-7, Japan), applying four different loads (0.098, 0.245, 0.490 and 0.980 N) (Grabco and Leu, 2010). Differential scanning calorimetry (DSC) was used to determine the melting temperature of these alloys at a heating rate of 10 K/min to 600°C for all solders (Mostafa Shalaby et al , 2017).…”

Section: Methodsmentioning

confidence: 99%

ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder

Al-sorory

Gumaan

Shalaby

2022

SSMT

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Purpose This paper aims to summarise the effects of ZnO nanoparticles (0.1, 0.3, 0.5, 0.7 and 1.0 Wt.%) on the structure, mechanical, electrical and thermal stability of Sn–3.5Ag–0.5Cu (SAC355) solder alloys for high-performance applications. Design/methodology/approach The phase identification and morphology of the solders were studied using X-ray diffraction and scanning electron microscopy. Thermal parameters were investigated using differential scanning calorimetry. The elastic parameters such as Young's modulus (E) and internal friction (Q−1) were investigated using the dynamic resonance technique, whereas the Vickers hardness (Hv) and creep indentation (n) were examined using a Vickers microhardness tester. Findings Microstructural analysis revealed that ZnO nanoparticles (NPs) were distributed uniformly throughout the Sn matrix. Furthermore, addition of 0.1, 0.3 and 0.7 Wt.% of ZnO NPs to the eutectic (SAC355) prevented crystallite size reduction, which increased the strength of the solder alloy. Mechanical parameters such as Young's modulus improved significantly at 0.1, 0.3 and 0.7 Wt.% ZnO NP contents compared to the ZnO-free alloy. This variation can be understood by considering the plastic deformation. The Vickers hardness value (Hv) increased to its maximum as the ZnO NP content increased to 0.5. A stress exponent value (n) of approximately two in most composite solder alloys suggested that grain boundary sliding was the dominant mechanism in this system. The electrical resistance (ρ) increased its maximum value at 0.5 Wt.% ZnO NPs content. The addition of ZnO NPs to plain (SAC355) solder alloys increased the melting temperature (Tm) by a few degrees. Originality/value Development of eutectic (SAC355) lead-free solder doped with ZnO NPs use for electronic packaging.

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Shear analysis of rice husk ash (RHA) reinforced tin‐0.7‐copper composite solders on electroless nickel/immersion silver (ENIAg) surfaces

Hanim

Wei

Dele‐Afolabi

et al. 2021

Materialwissenschaft Werkst

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In this study, the mechanical performance of the rice husk ash-reinforced tin-0.7 copper composite solder was investigated. 0.01 wt.%, 0.05 wt.% and 0.1 wt.% of rice husk ash (RHA) were added to the solder matrix to prepare the composite solders. In order, to replace the costly electroless nickel immersion gold surface finish on the copper substrate, the effect of electroless nickel immersion silver (ENIAg) as the surface finish was studied. The differential scanning calorimetry (DSC) analysis showed that the composite solder exhibited lower melting temperature relative to the plain solder owing to the inclusion of rice husk ash. Shear strength analysis was carried out to investigate the influence of rice husk ash and electroless nickel immersion silver surface finish on the shear strength of the developed composite solders. The results proved that the rice husk ash failed to enhance the shear strength of tin-0.7 copper lead-free solder with the plain solder exhibiting the highest shear strength.Keywords: Lead free solder / rice husk ash / tin-copper / electroless nickel / immersion silver / microstructure / mechanical properties Schlüsselwörter: Bleifreier Lotwerkstoff / Reisschalenasche / Zinn-Kupfer / chemisch Nickel / chemisch Silber / Gefüge / mechanische Eigenschaften

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Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

Cited by 42 publications

References 21 publications

Effect of TiO₂ nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy

Effect of TiO₂ nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy

ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder

Shear analysis of rice husk ash (RHA) reinforced tin‐0.7‐copper composite solders on electroless nickel/immersion silver (ENIAg) surfaces

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Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

Cited by 42 publications

References 21 publications

Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy

Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy

ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder

Shear analysis of rice husk ash (RHA) reinforced tin‐0.7‐copper composite solders on electroless nickel/immersion silver (ENIAg) surfaces

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Product

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Effect of TiO₂ nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy

Effect of TiO₂ nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy