2023
DOI: 10.1108/ssmt-12-2022-0061
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Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage

Meng Jiang,
Yang Liu,
Ke Li
et al.

Abstract: Purpose The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS). Design/methodology/approach In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized. Findings The results indicated that the degradation of the shear pro… Show more

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