Abstract:Dissimilar transient liquid phase (TLP) bonding of AZ91C magnesium alloy to 316L stainless steel was carried out using a pure copper filler metal. The bonding process was conducted in two stages where TLP bonding of 316L to Cu interlayer was first performed and then followed by bonding AZ91C to the other side of the copper interlayer. It was indicated that the temperature rise enhanced the inter-diffusion of elements at the AZ91C/Cu interface and encouraged the formation of hard intermetallic Mg2Cu compound. R… Show more
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