2nd International Congress on 3D Materials Science 2014
DOI: 10.1002/9781118990278.ch9
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Microstructural Data for Model Development and Validation

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“…Thermal cycling, fatigue, and shock-wave loading, however, are mostly responsible for distributed fracture zones [27]. Thus, active processes in this work are identified, according to Figure 1 (b), with connected or unconnected sets of heterogeneous fractures Γ κ of interfacial elasticity K κ (ξ).…”
mentioning
confidence: 92%
“…Thermal cycling, fatigue, and shock-wave loading, however, are mostly responsible for distributed fracture zones [27]. Thus, active processes in this work are identified, according to Figure 1 (b), with connected or unconnected sets of heterogeneous fractures Γ κ of interfacial elasticity K κ (ξ).…”
mentioning
confidence: 92%
“…Stress concentration, chemical reaction, and early-stage irradiation are common producers of interfacial damage at micro-and meso-scales [40,28]. Thermal cycling, fatigue, and shock-wave loading, however, are mostly responsible for distributed fracture zones [27]. Thus, active processes in this work are identified, according to Figure 1 (b), with connected or unconnected sets of heterogeneous fractures Γ κ of interfacial elasticity K κ (ξ).…”
mentioning
confidence: 94%