Microstructural development of diffusion-brazed austenitic stainless steel to magnesium alloy using a nickel interlayer

Elthalabawy, Waled M.; Khan, Tahir I.

doi:10.1016/j.matchar.2010.04.001

Cited by 57 publications

(22 citation statements)

References 10 publications

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“…It removed the initial oxides or impurities from the surface of two materials, which were also described in many early reports [4,32]. The existence of such oxide film was detrimental in other connection methods such as resistance welding [33] or diffusion bonding [34], as it could decrease the bond strength of joints. In order to discuss the distribution of elements across the bonding interface, the representative concentration profiles of Fe, Cr, Ni in the 2205 stainless steel and Mg, Al in the AZ31B are shown in Figure 8.…”

Section: Morphology Near the Interfacementioning

confidence: 88%

Microstructural Characteristics and Mechanical Properties of 2205/AZ31B Laminates Fabricated by Explosive Welding

2017

Metals

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Abstract:A bimetal composite of 2205 duplex stainless steel and AZ31B magnesium alloy was cladded successfully through the method of explosive welding. The microstructural characteristics and mechanical properties of 2205/AZ31B bimetal composite are discussed. The interface of 2205/AZ31B bimetallic composite was a less regular wavy morphology with locally melted pockets. Adiabatic shear bands occurred only in the AZ31B side near explosive welding interface. The microstructure observed with EBSD showed a strong refinement near the interface zones. Line scan confirmed that the interface had a short element diffusion zone which would contribute to the metallurgical bonding between 2205 duplex stainless steel and AZ31B magnesium alloy. The value of micro-hardness near the bonding interface of composite plate increased because of work hardening and grain refinement. The tensile shear strength of bonding interface of 2205/AZ31B composite was 105.63 MPa. Tensile strength of 2205/AZ31B composite material was higher than the base AZ31B. There were two abrupt drops in stress in the stress-strain curves of the 2205/AZ31B composite materials.

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Section: Morphology Near the Interfacementioning

confidence: 88%

Microstructural Characteristics and Mechanical Properties of 2205/AZ31B Laminates Fabricated by Explosive Welding

2017

Metals

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“…For example, it is well known that considerably higher hardness occurs at the interface between Al and Mg alloys by the generation of brittle Al-Mg intermetallic compounds (IMCs), resulting in catastrophic debonding or low joint strength [12,13]. In order to improve bonding strength by retarding or suppressing the development of Al 3 Mg 2 and Al 12 Mg 17 binary IMCs at the interface, the use of interlayer consisting of Zn, Cu, or Ni between the Al and Mg alloys during the solid-state diffusion bonding process has been reported [14,15]. However, from an economic point of view, in terms of process time and temperature, inserting a high-purity metal foil between Al and Mg alloys is not favorable, especially with the wide-width roll-bonding process.…”

Section: Introductionmentioning

confidence: 99%

Interface-correlated deformation behavior of a stainless steel-Al–Mg 3-ply composite

Lee

Kim

et al. 2013

Materials Characterization

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“…Therefore, transient liquid phase (TLP) diffusion bonding method was developed to minimize the problems for joining or repairing components. TLP bonding is a relatively advanced solid-state joining process which has the ability to join similar and dissimilar metals [3][4][5][6][7][8]. This method is based on using an interlayer between faying surfaces of base materials.…”

Section: Introductionmentioning

confidence: 99%

Effect of bonding parameters on microstructure development during TGTLP bonding of Al7075 alloy

Afghahi

Ekrami

Farahany

et al. 2014

Philosophical Magazine

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The effect of temperature, pressure and bonding time on microstructure of temperature gradient transient liquid phase (TGTLP) diffusion bonded Al7075 alloy using liquid gallium interlayer was investigated. The selected bonding method relies on using the minimum amount of liquid gallium on faying surfaces, using a very fast heating rate to reach the joining temperature and imposing a temperature gradient across the bond region. The microstructure of the diffusion bonded joints was evaluated by light optical microscopy, scanning electron microscopy and energy dispersive spectroscopy (EDS). Results show that by increasing the temperature, pressure and time of joining, a more uniform microstructure can be obtained at the joint area. The best joint microstructure was achieved at a temperature of 460°C, pressure of 10 MPa and time of 10 min. EDS spot analysis indicates that brittle silicon-rich precipitates form at the joint line during TGTLP bonding.

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Microstructural development of diffusion-brazed austenitic stainless steel to magnesium alloy using a nickel interlayer

Cited by 57 publications

References 10 publications

Microstructural Characteristics and Mechanical Properties of 2205/AZ31B Laminates Fabricated by Explosive Welding

Microstructural Characteristics and Mechanical Properties of 2205/AZ31B Laminates Fabricated by Explosive Welding

Interface-correlated deformation behavior of a stainless steel-Al–Mg 3-ply composite

Effect of bonding parameters on microstructure development during TGTLP bonding of Al7075 alloy

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