2022
DOI: 10.20517/microstructures.2021.11
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Microstructural evolution and ferroelectricity in HfO2 films

Abstract: Ferroelectric (FE) materials, which typically adopt the perovskite structure with non-centrosymmetry and exhibit spontaneous polarization, are promising for applications in memory, electromechanical and energy storage devices. However, these advanced applications suffer from the intrinsic limitations of perovskite FEs, including poor complementary metal oxide semiconductor (CMOS) compatibility and environmental issues associated with lead. Hafnium oxide (HfO2), with stable bulk centrosymmetric phases, possesse… Show more

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Cited by 16 publications
(15 citation statements)
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References 143 publications
(294 reference statements)
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“…Several previous articles have summarized studies on fluorite structured FE and AFE materials, commonly focusing on deposition methods of thin films, [26] epitaxial thin films, [27] energyand memory-related properties, [9,[28][29][30][31][32] and reliability [33][34][35] of fluorite structured materials. In this paper, we will examine and broaden our present understanding of ferroelectricity in hafnium oxide-based films.…”
Section: Cycles)mentioning
confidence: 99%
See 1 more Smart Citation
“…Several previous articles have summarized studies on fluorite structured FE and AFE materials, commonly focusing on deposition methods of thin films, [26] epitaxial thin films, [27] energyand memory-related properties, [9,[28][29][30][31][32] and reliability [33][34][35] of fluorite structured materials. In this paper, we will examine and broaden our present understanding of ferroelectricity in hafnium oxide-based films.…”
Section: Cycles)mentioning
confidence: 99%
“…In 2011, FE and antiferroelectric (AFE) properties in HfO 2 -based materials were reported. [7] These fluorite structure materials exhibit several advantages, such as simple binary oxide, lead-free, direct integration on the silicon wafer, ultralow deposition thickness (e.g., ≈10 nm), comparatively low dielectric constant (30)(31)(32)(33)(34)(35)(36)(37)(38)(39)(40), low leakage current, and compatibility with 3D nanostructures over the conventional FE materials. [8][9][10] The above-mentioned original publication by Böschke et al has led to a renaissance of FE memory concepts and increasing research interest focusing on this topic, as seen by the increasing number of citations of this original paper (Figure 1).…”
Section: Introductionmentioning
confidence: 99%
“…11 Great effort has been devoted to improving the stability and proportion of the orthorhombic phase, including element doping (Si, Zr, Al, Y, La, etc. ), 12 interface engineering, 13 electrode materials (TiN, W, Mo, Pt, etc. ), 14 and also the annealing process.…”
Section: Introductionmentioning
confidence: 99%
“…10–25 nm HZO films were studied and showed that the polarization and the ratio of o-phase decreased with increasing film thickness . This is due to the fact that as the film thickness increases, the surface energy loses its major contribution to the total energy, and the stability of o-phase is compromised . The microstructure also affects the wake-up and fatigue effects of HfO 2 films, the phenomena caused by the movement of oxygen vacancies, the rearrangement of which could be induced by voltage.…”
Section: Introductionmentioning
confidence: 99%