2018
DOI: 10.1007/s11661-018-4918-3
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Microstructural Evolution and Mechanical Properties Evaluation of IN-939 Bonds Made by Isothermal Solidification of a Liquated Ni-Cr-B Interlayer

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Cited by 19 publications
(5 citation statements)
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“…BNi 3 + c binary eutectic in the athermal solidification zone has been observed during the TLP process at 1120°C using Ni-Cr-B as the filler metal. [30] From the data presented in Table II, it is evident that about 3.8 at. pct Si can be dissolved in the c solid solution (c-ISR).…”
Section: ! L þ C ½1mentioning
confidence: 94%
“…BNi 3 + c binary eutectic in the athermal solidification zone has been observed during the TLP process at 1120°C using Ni-Cr-B as the filler metal. [30] From the data presented in Table II, it is evident that about 3.8 at. pct Si can be dissolved in the c solid solution (c-ISR).…”
Section: ! L þ C ½1mentioning
confidence: 94%
“…But, in some reports, the application of pressure was necessary to improve bonding. Hence, using the mentioned holding fixture, a pressure of 10 MPa was applied for this experiment [19].…”
Section: Methodsmentioning
confidence: 99%
“…This is called isothermal solidification, which is more convenient than solidification by cooling [11,12,21,[13][14][15][16][17][18][19][20]. In previous studies, similar and dissimilar TLP bonding of several Ni-based superalloys such as IN-617 [22][23][24][25], IN-939 [16,[26][27][28],…”
Section: Introductionmentioning
confidence: 99%