Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

Ismail, Norliza; Jalar, Azman; Bakar, Maria Abu; Safee, Nur Shafiqa; Yusoff, Wan Yusmawati Wan; Ismail, Ariffin

doi:10.1108/ssmt-11-2019-0035

Cited by 13 publications

(7 citation statements)

References 38 publications

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“…It is known that CNT did not react with the elements in the SAC305 solder matrix to form some stable intermetallic compound. 29 However, the microstructure of SAC305 solder joint was found to have been changed due to the incorporation of CNT. From the EDX mapping, the SAC305-CNT0.04 solder matrix indicates a broad distribution area of the eutectic phase compared to the SAC305 solder.…”

Section: Resultsmentioning

confidence: 99%

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Ismail

Jalar

Atiqah

et al. 2021

Nanomaterials and Nanotechnology

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The main objective of this study is to investigate the electrical properties of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotube instead of solder bulk. Sn–3.0Ag–0.5Cu solder paste with the incorporation of carbon nanotube up to 0.04 wt% was fabricated by using mechanical mixing method. Fabricated solder pastes were then soldered on printed circuit board via reflow soldering at 260°C peak temperature. Electrical resistivity of Sn–3.0Ag–0.5Cu-carbon nanotube solder joints was measured by the four-point probe method at room temperature. Microstructure properties were observed by optical microscope and field emission scanning electron microscope. Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint was found to increase with the incorporation carbon nanotube up to 0.03 wt% and slightly decrease at 0.04 wt%. Incorporation of carbon nanotube in the solder matrix apparently changes the microstructure of Sn–Ag–Cu solder alloys. Microstructural observation found that electrical resistivity correlated with the distribution area of eutectic phase in the solder matrix due to the existence of carbon nanotube. It was revealed that eutectic phase area increases with the increasing of carbon nanotube wt% up to 0.03 and then slightly decreases at the incorporation of 0.04 wt% carbon nanotube as parallel with the trend of electrical resistivity values.

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Section: Resultsmentioning

confidence: 99%

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Ismail

Jalar

Atiqah

et al. 2021

Nanomaterials and Nanotechnology

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“…Both samples were ground with 240, 320, 600, 800, 1000, and 2000 grit Silicon Carbide paper with flowing water. Subsequently, diamond paste of 6, 3, and 1 micron was used to polish the surface, followed by oxide polishing for up to 60 seconds [1,2]. The solder balls' microstructure was then examined using an optical microscope and evaluated with ImageJ software.…”

Section: Characterizationmentioning

confidence: 99%

“…The performance of electronic devices depends on continuous improvement in miniaturization, application, technology, and cost. One of the most important advances that keeps electronics manufacturers constantly on their toes is the introduction of an extremely dense integrated circuit with higher reliability for various applications up to extreme conditions with finer pitch of solder joint interconnection [1][2][3][4][5]. When utilized in surface mount technology (SMT), interconnect technology such as ball grid array (BGA), offer a special advantage as they provide integrated circuit (IC) package technology, which makes devices with integrated circuits smaller, cheaper, and reduction in weight, with increased performance.…”

Section: Introductionmentioning

confidence: 99%

Thermal cycling effect on the crack formation of solder joint in ball grid array package

Suhaimi

Bakar

Jalar

et al. 2022

J. Phys.: Conf. Ser.

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Ball grid array (BGA) technology is one of the technologies used in surface mount technology (SMT). It provides many interconnection points via the solder ball and thus give advantages such as good heat dissipation, improved the PCB design, BGA package become robust and reliable. In electronic industry, the reliability of BGA package is being concerned. Thermal cycling test (TCT)is one of typical reliability test used to investigate the reliability of the BGA package. This study investigates on the thermal cycling effect on the crack formation of solder joint in ball grid array package. The BGA package was subjected to thermal cycle test with temperature cyclic of -40°C and 85°C for 500, 750 and 1000 cycles. The finding shows that the cracks were observed in solder joint in 750 and 1000 cycles. This shows that the BGA package is sensitive to the thermal cycling and effect its reliability. The package was modified with adding underfill materials and tested through the same cycles. Cross sectional and Dye and pry test show no crack formation and dye penetration for all thermal cycles in the BGA package with underfill.

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“…Pun et al (2016) have studied the effect of substrate surface finish, pad sizes and substrate flatness on occurrence of solder joint failure in Cu pillar solder flip chip interconnects. Ismail et al (2021) have examined the influence of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical properties of solder joint under blast wave condition. Their results showed that the explosive weight of microstructure is increased as the interfacial layer is increased.…”

Section: Introductionmentioning

confidence: 99%

Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach

Ishak

Aziz

Ismail

et al. 2021

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Purpose The purpose of this paper is to present the experimental and simulation studies on the influence of copper pillar bump structure on flip chip packaging during reflow soldering. Design/methodology/approach In this work, solidification/melting modelling and volume of fluid modelling were used. Reflow soldering process of Cu pillar type FC was modelled using computational fluid dynamic software (FLUENT). The experimental results have been validated with the simulation results to prove the accuracy of the numerical method. Findings The findings of this study reveal that solder volume is the most important element influencing reflow soldering. The solder cap volume reduces as the Cu pillar bump diameter lowers, making the reflow process more difficult to establish a good solder union, as less solder is allowed to flow. Last but not least, the solder cap height for the reflow process must be optimized to enable proper solder joint formation. Practical implications This study provides a basis and insights into the impact of copper pillar bump structure on flip chip packaging during reflow soldering that will be advancing the future design of 3D stack package. This study also provides a superior visualization and knowledge of the melting and solidification phenomenon during the reflow soldering process. Originality/value The computational fluid dynamics analysis of copper pillar bump structure on flip chip packaging during reflow soldering is scant. To the authors’ best knowledge, no research has been concentrated on copper pillar bump size configurations in a thorough manner. Without the in-depth study, copper pillar bump size might have the impact of copper pillar bump structure on flip chip packaging during reflow soldering. Five design of parameter of flip chip IC package model was proposed for the investigation of copper pillar bump structure on flip chip packaging during reflow soldering.

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Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

Cited by 13 publications

References 38 publications

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Thermal cycling effect on the crack formation of solder joint in ball grid array package

Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach

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