Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

El-Daly, A.A.; Fawzy, A.; Mohamad, A.Z.; El-Taher, A. M.

doi:10.1016/j.jallcom.2011.01.109

Cited by 87 publications

(44 citation statements)

References 26 publications

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“…These include compositional and heat treatment effects on the matrix phase and IMC chemistries, impurity segregation to interfaces, the nature of the interface formed between the IMCs and the matrix, and the growth rate and stability of the soft and hard IMCs in the alloy matrix. 26 …”

Section: Influence Of Strain Rate On the Mechanical Propertiesmentioning

confidence: 99%

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Hammad

El-Taher

2014

Journal of Elec Materi

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The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni) 6 Sn 5 intermetallic compounds (IMCs) inside the b-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni) 6 Sn 5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)-and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

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Section: Influence Of Strain Rate On the Mechanical Propertiesmentioning

confidence: 99%

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Hammad

El-Taher

2014

Journal of Elec Materi

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“…The extremely small size of advanced electronic devices, combined with the size of the solder bump, can significantly increase the current density [13]. Since Joule heating is proportional to the square of the current density, the local temperatures of conductive lines and solder bumps will increase substantially which minimize the lifetime of electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

Fouzder

Chan

Chan³

2014

J Mater Sci: Mater Electron

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Nano-sized, non-reacting, non-coarsening CeO 2 particles with a density close to that of solder alloy were incorporated into Sn-3.0 wt%Ag-0.5 wt%Cu solder paste. The interfacial microstructure and hardness of Ag surfacefinished Cu substrates were investigated, as a function of reaction time, at various temperatures. After the initial reaction, an island-shaped Cu 6 Sn 5 intermetallic compound (IMC) layer was clearly observed at the interfaces of the SnAg-Cu based solders/immersion Ag plated Cu substrates. However, after a prolonged reaction, a very thin, firmly adhering Cu 3 Sn IMC layer was observed between the Cu 6 Sn 5 IMC layer and the substrates. Rod-like Ag 3 Sn IMC particles were also clearly observed at the interfaces. At the interfaces of the Sn-Ag-Cu based solder-Ag/Ni metallized Cu substrates, a (Cu, Ni)-Sn IMC layer was found. Rod-like Ag 3 Sn and needle-shaped Cu 6 Sn 5 IMC particles were also observed on the top surface of the (Cu, Ni)-Sn IMC layer. As the temperature and reaction time increased, so did the thickness of the IMC layers. In the solder ball region of both systems, a fine microstructure of Ag 3 Sn, Cu 6 Sn 5 IMC particles appeared in the b-Sn matrix. However, the growth behavior of the IMC layers of composite solder doped with CeO 2 nanoparticles was inhibited, due to an accumulation of surface-active CeO 2 nanoparticles at the grain boundary or in the IMC layers. In addition, the composite solder joint doped with CeO 2 nanoparticles had a higher hardness value than the plain Sn-Ag-Cu solder joints, due to a well-controlled fine microstructure and uniformly distributed CeO 2 nanoparticles. After 5 min of reaction on immersion Agplated Cu substrates at 250°C, the micro-hardness values of the plain Sn-Ag-Cu solder joint and the composite solder joints containing 1 wt% of CeO 2 nanoparticles were approximately 16.6 and 18.6 Hv, respectively. However after 30 min of reaction, the hardness values were approximately 14.4 and 16.6 Hv, while the micro-hardness values of the plain Sn-Ag-Cu solder joints and the composite solder joints on Ag/Ni metallized Cu substrates after 5 min of reaction at 250°C were approximately 15.9 and 17.4 Hv, respectively. After 30 min of reaction, values of approximately 14.4 and 15.5 Hv were recorded.

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“…The increase of Cu atom quantity from porous Cu into interfacial reactions during solidification of molten solder leads to formation of the IMC layer. This interaction between Cu atoms and element from molten solder had possibly restricted the atom dislocation movement and thereby increased the motion resistances of the solder joint, which ultimately generated plastic behavior of the solder joint [13,[27][28][29]. …”

Section: Fractured Surfacementioning

confidence: 99%

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Jamadon

Tan

Yusof

et al. 2016

Metals

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Abstract:The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi-pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 • C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 • C) and 54 MPa (at 300 s and 307 • C ), respectively. The fractography of the solder joint was analyzed by optical microscope (OM) and scanning electron microscopy (SEM). The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i) SAC305/Cu interface; (ii) inside SAC305 solder alloy; and (iii) inside porous Cu. Energy dispersive X-ray spectroscopy (EDX) was used to identify intermetallic phases. Cu 6 Sn 5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy.

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Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu

Cited by 87 publications

References 26 publications

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

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