2022
DOI: 10.1016/j.vacuum.2022.111007
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Microstructural evolution of Cu/W nano-multilayers filler metal during thermal treatment

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Cited by 7 publications
(2 citation statements)
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“…than the mean surface energy of the particles formed on the NML surface. [8] The surface outflow phenomenon has been thoroughly investigated in NMLs of various material systems (immiscible or semimiscible), e.g., Cu/W, [9,23] Ag/AlN, [24] Ag-Cu/AlN, [25] Ag-Ge/ AlN, [16] Al-Si/AlN, [26] and Cu/AlN-Al 2 O 3 [27] NMLs. Typically, the outflowing material is a metal phase with a lower melting point (compared to other constituents of an NML) and high diffusion mobility.…”
Section: Doi: 101002/pssa202300876mentioning
confidence: 99%
“…than the mean surface energy of the particles formed on the NML surface. [8] The surface outflow phenomenon has been thoroughly investigated in NMLs of various material systems (immiscible or semimiscible), e.g., Cu/W, [9,23] Ag/AlN, [24] Ag-Cu/AlN, [25] Ag-Ge/ AlN, [16] Al-Si/AlN, [26] and Cu/AlN-Al 2 O 3 [27] NMLs. Typically, the outflowing material is a metal phase with a lower melting point (compared to other constituents of an NML) and high diffusion mobility.…”
Section: Doi: 101002/pssa202300876mentioning
confidence: 99%
“…Upon annealing, grooving of GB is a possible way to minimize the internal energy. This brings to the transformation of the NML into a nanocomposite (NC) [13,14]. Prior to NML degradation, i.e., in the temperature range of 400 -600 °C, the Cu/W NML system first releases the accommodated residual stresses in the Cu and W nanolayers (while maintaining the multilayer structure) [15].…”
mentioning
confidence: 99%