Microstructural stability, defect structures and deformation mechanisms in a Ag3Sn/Cu3Sn alloy

Sun, Yu; Yu, Haibo; Kesim, Mehmet; Alpay, S. P.; Aindow, Mark

doi:10.1007/s10853-016-0590-4

Cited by 11 publications

(5 citation statements)

References 40 publications

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“…Early studies [3] suggested that deformation in Ag 3 Sn can proceed by {011}-type twinning, and this is consistent with the results of micro-hardness indentation studies [5]. In a recent study [6] we characterized defect structures in a Ag 3 Sn-Cu 3 Sn pseudo-binary alloy deformed in compression. A high density of dislocations was generated in the Ag 3 Sn grains, but no deformation twinning was observed.…”

supporting

confidence: 82%

Characterization of Dislocations in Single-Crystalline Ag₃Sn Intermetallic Alloys

Sun

Lee

et al. 2017

Microsc Microanal

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The intermetallic compound Ag 3 Sn is an important component phase present in both dental amalgams [1] and lead-free solders for microelectronic applications [2]. Ag 3 Sn exhibits the D0 a Cu 3 Ti-type structure, which is an ordered orthorhombic form of the HCP structure [3]. The phase is unusually ductile for an intermetallic compound, but there have been very few studies on the defects and deformation mechanisms in Ag 3 Sn due to the difficulty of making high quality single phase samples [4]. Early studies [3] suggested that deformation in Ag 3 Sn can proceed by {011}-type twinning, and this is consistent with the results of micro-hardness indentation studies [5]. In a recent study [6] we characterized defect structures in a Ag 3 Sn-Cu 3 Sn pseudo-binary alloy deformed in compression. A high density of dislocations was generated in the Ag 3 Sn grains, but no deformation twinning was observed. However, the character of these dislocations was not analyzed in detail. In the present study, we have examined the dislocations structures in deformed single-crystal Ag 3 Sn and the operative deformation mechanisms were considered.Single-phase Ag 3 Sn crystals several millimeters in size were produced by a solution growth method [7]. The single-crystal specimens were deformed by bending at room temperature, and the microstructures of the deformed crystals were evaluated using transmission electron microscopy (TEM). Cross-sectional TEM specimens through the (001) free surface were prepared using an FEI Helios Nanolab 460F1 dualbeam focused ion beam (FIB) instrument following the procedures described by Yu et al. [4]. The TEM specimens were examined in an FEI Talos F200X S/TEM operating at accelerating voltage of 200 kV.The deformed Ag 3 Sn crystals contained both twins and dislocations, and particular attention was paid to the character of the dislocations. Figure 1 is a bright-field (BF) TEM image from a typical area in deformed Ag 3 Sn taken under two-beam conditions with g = 040, where g is the reciprocal lattice vector of the diffracting planes. The beam direction is close to [100]. Many parallel dislocations are present, and these extend for up to 1.5 µm within the specimen volume. The average dislocation density was calculated as ρ = 10 9 -10 10 cm -2 based on such images. The Burgers vectors, b, were determined by diffraction contrast analyses using the gb = 0 criterion, and it was found all the segments are edge dislocations having Burgers vectors, b, parallel to [010]. Since the line directions of the defects are approximately [001], this is consistent with deformation on the [010](100) slip system. It is noted that most of the dislocations were present as dislocation pairs, with a separation of up to 30 nm. To determine if these paired dislocations are partial dislocations or dislocation dipoles, BF TEM images were taken with ±g (g = 040), as presented in Figure 2. Significant changes in spacing between these dislocation pairs were noticed on reversing the sign of g. This inside/outside contrast reveals that the...

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confidence: 82%

Characterization of Dislocations in Single-Crystalline Ag₃Sn Intermetallic Alloys

Sun

Lee

et al. 2017

Microsc Microanal

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“…The structure of the solder pad (such as its roughness) also influences the IMC, though not primarily in its growth rate, but rather in the IMC ratio between various intermetallic phases, such as Ag 3 Sn, Cu 3 Sn, and Cu 6 Sn 5 phases [12], where their presence is both inevitable and necessary. On the contrary, it may cause reliability issues [5]. As already indicated, the formation and growth of intermetallic layers depend on the solder alloy composition [13,14].…”

Section: Materials Effect On Imc Growthmentioning

confidence: 98%

“…As per the restriction of hazardous substances (ROHS) directive, one of the widely used solders are of the SAC type (SnAgCu). Therefore, Ag 3 Sn IMCs are also present in Sn-based solder joints [5][6][7].…”

Section: Materials Effect On Imc Growthmentioning

confidence: 99%

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

et al. 2021

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Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment. The influence of multiple reflows was also observed. The intermetallic layer thicknesses were obtained by the image analysis of micro-section images. The flux type proved to have a significant impact on the intermetallic layer thickness. The solder paste with ROL1 caused an increase in IML thickness by up to 40% in comparison to an identical paste with ROL0 flux. Furthermore, doubling the roughness of the solder mask has increased the resulting IML thickness by 37% at HASL surface finish and by an average of 22%.

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“…Dental amalgam material has been a subject of controversy among the dental community worldwide due to the release of mercury (Hg) vapor from the material when placed in human teeth during and subsequent to the placement of the material for clinical restorations of posterior human teeth [1][2][3]. Such material has been utilized by dentists in the United States for the restoration of posterior human teeth since 1833, with additional altercations in material compositions [4][5][6][7]. The purpose of the research was to determine and investigate the effects of the addition of titanium powder to dental amalgam constituents and determine how, if any, the mercury vapor released from the dental amalgam is affected by the incremental addition of titanium powder to the alloy.…”

Section: Introductionmentioning

confidence: 99%

Dental Metal Matrix Composites: The Effects of the Addition of Titanium Nanoparticle Particles on Dental Amalgam

Moxon,

Xu,

Tettey

et al. 2024

Materials

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Dental amalgams have been used by dentists for the restoration of posterior human teeth. However, there have been concerns about the release of mercury from amalgams into the oral cavity. The objective of the present research is to study the effect of titanium (Ti) nanoparticles on the microstructural mechanism of the release of mercury vapor in two commonly used brands of dental amalgam (the Dispersalloy: 11.8% Cu; the Sybralloy: 33% Cu). Ti powder was added to both the Dispersalloy and the Sybralloy in increments of 10 mg up to 80 mg. The addition of Ti powder to both brands of dental amalgam has been found to result in a considerable decrease in Hg vapor release. The decrease in the Hg vapor release due to Ti addition has been explained by the formation of strong Hg–Ti covalent bonds, which reduce the availability of Hg atoms for evaporation. The Ti atoms in excess of the solubility limit of Ti in Hg reside in the grain boundaries, which also reduces the evaporation of Hg from the amalgam. The binding of Hg with Ti via a strong covalent bond also results in a significant improvement in mechanical properties such as Vickers hardness.

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Microstructural stability, defect structures and deformation mechanisms in a Ag3Sn/Cu3Sn alloy

Cited by 11 publications

References 40 publications

Characterization of Dislocations in Single-Crystalline Ag₃Sn Intermetallic Alloys

Characterization of Dislocations in Single-Crystalline Ag₃Sn Intermetallic Alloys

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Dental Metal Matrix Composites: The Effects of the Addition of Titanium Nanoparticle Particles on Dental Amalgam

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Microstructural stability, defect structures and deformation mechanisms in a Ag3Sn/Cu3Sn alloy

Cited by 11 publications

References 40 publications

Characterization of Dislocations in Single-Crystalline Ag3Sn Intermetallic Alloys

Characterization of Dislocations in Single-Crystalline Ag3Sn Intermetallic Alloys

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Dental Metal Matrix Composites: The Effects of the Addition of Titanium Nanoparticle Particles on Dental Amalgam

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Characterization of Dislocations in Single-Crystalline Ag₃Sn Intermetallic Alloys

Characterization of Dislocations in Single-Crystalline Ag₃Sn Intermetallic Alloys