Microstructural Stability of Stressed Lamellar and Fiber Composites

Sridhar, Nigamanth; Rickman, J. M.; Srolovitz, David J.

doi:10.1016/s1359-6454(96)00413-2

Cited by 49 publications

(37 citation statements)

References 15 publications

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“…The stresses may create local perturbations, as marked by the boxes in Fig. 11, with wavelengths greater than critical wavelength for Rayleigh instability, along the extremely elongated high-aspect ratio grains in layer thickness, and hence trigger a classical Rayleigh instability [65]. Additionally, the interface fluctuations during the CARB process may also cause local perturbations.…”

Section: Rayleigh Instabilitymentioning

confidence: 99%

High strength and thermal stability of bulk Cu/Ta nanolamellar multilayers fabricated by cross accumulative roll bonding

et al. 2016

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Section: Rayleigh Instabilitymentioning

confidence: 99%

High strength and thermal stability of bulk Cu/Ta nanolamellar multilayers fabricated by cross accumulative roll bonding

et al. 2016

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“…Considering the above-mentioned driving forces, one possible driving force for morphological instabilities in multilayer systems is the reduction of elastic strain energy, which can arise from numerous sources, including mismatches in lattice constants, thermal expansion coefficients, or elastic constants between the layers [5,10,11]. The main contribution to the elastic stresses in MLCCs arises from the mismatch of densification rates between the ceramic layers and metal electrodes during co-sintering [7,8].…”

Section: Introductionmentioning

confidence: 99%

Effect of Cr additions on the microstructural stability of Ni electrodes in ultra-thin BaTiO3 multilayer capacitors

et al. 2007

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Microstructural control in thin-layer multilayer ceramic capacitors (MLCC) is one of the present day challenges to maintain an increase in capacitive volumetric efficiency. This present paper opens a series of investigations aimed to engineer the stability of ultra-thin Ni electrodes in BaTiO 3 -based multilayer capacitors using refractory metal additions to Ni. Here, pure Ni and Ni-1 wt.% Cr alloy powders are used to produce 0805-type BME MLCCs with 300 active layers and with dielectric and electrode layer thickness around 1 μm. To investigate the continuity of Ni electrodes, both MLCC chips with pure and doped electrodes were sintered at different temperatures for 5 h. It is found that the continuity of Ni electrodes is improved most likely due to the effect of Cr on the lowmelting point (Ni,Ba,Ti) interfacial alloy layer formation. The interfacial alloy layer is not observed when Cr is segregated at Ni-BaTiO 3 interface in the Cr-doped samples, while it is found in all undoped samples. The interfacial alloy layer is believed to increase mass-transfer along the Ni-BaTiO 3 interfaces facilitating an acceleration of Ni electrodes discontinuities.

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“…Spheroidization of lamellar composites is a two-step process (plates to rods, and then rods to spheres) and hence, the plate morphology is likely to resist spheroidization better than rods [8]. Typically, morphological instability in a lamellar structure starts at the edge of a finite plate (i.e., lamellae termination points) embedded in a matrix.…”

Section: Discussionmentioning

confidence: 99%

Thermal Stability of Self-Supported Metallic Multilayered Thin Films

2001

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The morphological stability and strength retention following elevated temperature exposure or thermal cycling will be crucial in exploiting the extremely high strengths of nanolayered materials in advanced engineering applications. The effects of elevated temperature (≤ 800 °C) vacuum annealing on the morphological stability and mechanical properties of sputter deposited Cu-Nb multilayers with 75 nm bilayer period are reported here. Even after 800 °C/ 1 hour anneal, the continuity of the layered structure is maintained and the bilayer periods are unchanged. The in-plane grain sizes in both Cu and Nb coarsened but were anchored at grooved boundaries preventing further growth. For a constant bilayer period, the effect of increasing the in-plane grain size on the multilayer hardness is found to be insignificant. After annealing, the layers are observed to be offset by shear along a vertical plane at the triple point junctions that have equilibrium groove angles aligned in a zig-zag pattern. A new mechanism is proposed for the evolution of this "anchored" structure that is resistant to further morphological instability.

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Microstructural Stability of Stressed Lamellar and Fiber Composites

Cited by 49 publications

References 15 publications

High strength and thermal stability of bulk Cu/Ta nanolamellar multilayers fabricated by cross accumulative roll bonding

High strength and thermal stability of bulk Cu/Ta nanolamellar multilayers fabricated by cross accumulative roll bonding

Effect of Cr additions on the microstructural stability of Ni electrodes in ultra-thin BaTiO3 multilayer capacitors

Thermal Stability of Self-Supported Metallic Multilayered Thin Films

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