Microstructure analysis and measurement of nonlinearity of vapour phase reflowed solder joints

Pietriková, Alena; Mach, Pavel; Durisin, Juraj; Livovský, Ľubomír; Urbancik, J.

doi:10.1109/isse.2008.5276669

Cited by 7 publications

(6 citation statements)

References 1 publication

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“…Applying Eq. (6), (7) and (8) along with the boundary conditions to all nodes using continuous indexing result in a system of simultaneous (implicit) equations in every phase. It can be expressed with matrices in the general from of A•T n+1 =B•T n +C, where double underline refers to square matrices and single underline represents column vectors.…”

Section: Adi Scheme For Non-homogeneous Materialsmentioning

confidence: 99%

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Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Bozsóki

Géczy

Illés

2019

International Journal of Heat and Mass Transfer

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In this paper the complex heat transfer process of the vapour phase soldering has been investigated on the level of electronic components. VPS is gaining increased attention lately, and the process needs different approach of modelling, compared to conventional soldering processes in electronics mass manufacturing. Component level modelling was not studied deeply in the literature before, so our focus pointed to heat transfer on large size surface mounted electronic components. Applying the Fourier type heat conduction equation, a detailed 3D thermal model of a polyester capacitor on a printed circuit board was implemented based on x-ray images of an actual assembly. Our model incorporates inner geometry, material inhomogeneity, composite materials and anisotropic thermal conductivity as important thermal features. Transient heating was calculated with Finite Difference Method combining an alternating direction implicit (ADI) approach, using averaged heat transfer coefficient. Validation measurements were taken in our VPS system. The measured data show good agreement with the calculation results and points to possible application for use in advanced engineering environment.

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Section: Adi Scheme For Non-homogeneous Materialsmentioning

confidence: 99%

“…Recently VPS was compared directly with more conventional convection type reflow by Dziurdzia [6], while the others focused more solely on VPS. It was found by Pietrikova [7] and Liu [8] that the microstructure of the joints formed in VPS ovens are dependent of the given setting and mode of the applied ovens.…”

Section: Introductionmentioning

confidence: 99%

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Bozsóki

Géczy

Illés

2019

International Journal of Heat and Mass Transfer

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show abstract

“…Others showed that the microstructure of the joints formed in VPS ovens are dependent of the given setting of the soldering profile in vapours. [10][11]. Setting of this profile [12] or optimizations with statistical methods [13] were also investigated.…”

Section: Fig 1 Scheme Diagram Of Vps Ovenmentioning

confidence: 99%

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Géczy¹,

Alaya²,

Hantos

et al. 2018

2018 41st International Spring Seminar on Electronics Technology (ISSE)

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Vapour Phase Soldering (VPS) is a reflow soldering method used for special assemblies, where even heat distribution, uniform and high soldering quality is critical. To aim for the best joint quality, it is important to investigate the process and the state of the work zone. While VPS is a much more complex process than regular reflow methods, our paper aims to approach the monitoring of the work zone by novel and alternative paths, which can ultimately lead to a better control on the ovens, aiming for compliance with the zero defect manufacturing, and Industry 4.0 directives. For our work, two paths were defined. With the use of an infracamera, the possibility of quantitative optical observation was investigated, also the equalized temperatures of the measured board can be verified. With pressure sensing, the state of the vapour blanket can be investigated, which can lead ultimately to more reliable working cycles. The latter method shows promising results pointing to more refined process control; the former method shows limitations in the application within the field of VPS.

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“…Vacuum VPS was also investigated by Lungen et al (2015), where the research team pointed to the quality improving importance of a proper temperature profile setting and the void reducing capability of the vacuum. Many research teams (Hurtony et al, 2012;Pietrikova et al, 2008;and Liu et al, 2015) inspected the microstructural characteristics of the VPS soldered joints, which are highly affected by the temperature settings of the process. Not only can the overall structure of the joint be influenced by different heating mechanisms but also the intermetallic layer is affected by different parameters of the heating.…”

Section: Introductionmentioning

confidence: 99%

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Géczy

Nagy

Illés

et al. 2017

SSMT

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Purpose The paper aims to present an investigation of heating during vapour phase soldering (VPS) on inclined printed circuit board (PCB) substrates. The PCB is a horizontal rectangular plate from the aspect of filmwise condensation with a given inclination setting. Design/methodology/approach The paper focuses on the measurement of temperature distribution on the PCBs with a novel setup immersed in the saturated vapour space. The measuring instrumentation is optimized to avoid and minimize vapour perturbing effects. Findings The inhomogeneity of the heating is presented according to the lateral dimensions of the PCB. The inclination improves temperature uniformity, improves heat transfer efficiency; however, a minor misalignment may affect the flow and result in uneven heating. Practical implications The results can be implemented for practical improvements in industrial ovens with the use of intended inclination. The improvements may consequently point to more efficient production and better joint quality. Originality/value The novel method can be used for deeper investigation of inclination during and can be complemented with numerical calculations. The results highlight the importance of precise PCB holding instrumentation in VPS ovens.

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Microstructure analysis and measurement of nonlinearity of vapour phase reflowed solder joints

Cited by 7 publications

References 1 publication

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

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