J. Electron. Mater.
 2024
DOI: 10.1007/s11664-024-11524-9
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Microstructure and Bonding Properties of Transient Liquid-Phase Bonding using Cu-SnAgCu Molded Sheets By High-Pressure Powder Compression

Ichizo Sakamoto,
Doojin Jeong,
Hiroaki Tatsumi
et al.
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