Microstructure and corrosion behavior of electrodeposited nanocrystalline nickel prepared from acetate bath

Sekar, R.; Kesavan, Jagadesh Kopula; Bapu, G.N.K. Ramesh

doi:10.1007/s11814-014-0289-7

Cited by 10 publications

(4 citation statements)

References 23 publications

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“…Saccharin has consistently been one of the most commonly used organic additives. [16][17][18] During the polishing process, it significantly enhances the wetting and dispersion properties of the polishing solution, contributing to a more uniform polishing process. Furthermore, this compound can form a protective film on the metal surface, reducing oxidation and other adverse reactions, effectively improving the quality of the passivation layer.…”

Section: Introductionmentioning

confidence: 99%

Low current density electropolishing and corrosion resistance study of 304 stainless steel

Zhu,

Li,

Wang

et al. 2024

Surface Engineering

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In response to the challenge posed by electrical breakdown occurrences during the conventional current density electrolytic polishing of large-scale stainless steel workpieces, this investigation delved into the parameters of low current density electrolytic polishing process. The study scrutinised the surface morphology and corrosion resistance of 304 stainless steel, employing tools such as metallographic microscopy, a roughness gauge, and an electrochemical workstation. Within a sulphuric acid–phosphoric acid-based electrolyte characterised by a volume ratio of 1:2, the optimal mass concentration ratio of salicylic acid and saccharin was ascertained to be 3:3. By configuring the process parameters to 10 A dm−2 and 20 min, outcomes of electrolytic polishing were obtained that stood on par with the conventional current density approach. The stainless steel surface exhibited a surface roughness measuring a mere 0.08 µm and characterised by a corrosion current density of 1.907 × 10−8 A cm−2 and a corrosion potential of −0.0965 V.

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Section: Introductionmentioning

confidence: 99%

Low current density electropolishing and corrosion resistance study of 304 stainless steel

Zhu,

Li,

Wang

et al. 2024

Surface Engineering

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“…Electrodeposited nickel films play an increasingly significant role in the electroplating industry because of their excellent anticorrosion, decoration, and wear resistance properties. [1][2][3] Many studies of nickel electrodeposition have been conducted in various electrolytes. However, smooth nickel deposits are difficult to obtain, and the use of appropriate additives in the electrolytes to modify the properties of the final deposits is indispensable in most cases.…”

mentioning

confidence: 99%

The Contribution of Heteroatoms in Amide Derivatives with an Identical Structure on Nickel Electrodeposits

Yuan

Chang

et al. 2019

J. Electrochem. Soc.

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Four amide derivatives, urea (U), thiourea (TU), acetamide (A), and thioacetamide (TA), all of which are based on the same molecular structure, were used as additives in the electrodeposition of nickel from ammoniacal media. The influence of the thiocarbamoyl, carbonyl, methyl, and amino groups on the nickel deposits was systematically evaluated to determine the contributions of the heteroatoms in the amide derivatives. The introduction of amino (-NH 2 ) or thiocarbamoyl (-C=S) groups was found to potentially benefit nickel deposition. The additive TU can change the nucleation mechanism of nickel from progressive to instantaneous nucleation, and can refine the grain size of the nickel deposits. The preferred crystallographic orientation, Ni(111), did not change in the presence of any of the four additives. Nevertheless, when TU or TA was added, the Ni(200) crystal plane was suppressed and the Ni(220) crystal plane was promoted. The energies of the highest occupied molecular orbital and lowest unoccupied molecular orbital, as well as the dipole moment, were determined to characterize the molecular features of the amide derivatives, and further verified that the S atom was the most probable adsorption center. These results were beneficial for understanding the mechanisms of the additives and for facilitating the rational design of additives for metal electrodeposition.

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“…[20][21][22] In particular, organic additives are used to obtain the preferred deposition profiles and/or the deposition properties that strongly affect the self-annealing process. 23,24 In Cu metallization, organic additives are essential because they can control the local deposition rate through an adsorption on the to-be-deposited surface, thereby inducing a voidfree filling of, for example, the damascene structure. Polyethylene glycol (PEG) and bis-(3-sulfopropyl) disulfide (SPS) are a representative suppressor and accelerator in Cu electrodeposition, respectively.…”

mentioning

confidence: 99%

Effects of Organic Additives on Grain Growth in Electrodeposited Cu Thin Film during Self-Annealing

Sung

Kim

Lim

et al. 2017

J. Electrochem. Soc.

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The microstructural changes in electrodeposited Cu films during self-annealing is demonstrated in this study. The structural change is strongly influenced by the organic additives in the Cu electrodeposition. The use of either polyethylene glycol (PEG) or bis-(3sulfopropyl) disulfide (SPS) decreases the Cu(111) grain size of deposited films, as the adsorption of the additives suppresses the surface diffusion of the Cu ions during the electrodeposition. After the electrodeposition, the average grain size of the deposited film was simultaneously increased by 10% in a self-annealing process to reduce the defect energy, which is mainly composed of the surface energy of the grains. Meanwhile, the grain grew 4 times larger than the as-deposited grain size during the self-annealing when both the PEG and SPS were introduced. The drastic grain growth was attributed to the accumulation of a high defect energy in the deposited film. The dynamic interaction between the co-adsorbed PEG and SPS on the Cu surface during the electrodeposition promotes an unoriented dispersion-type deposition, resulting in high-strain energy as well as surface energy. Releasing the strain energy accumulated by the high density of misorientation also leads to the simultaneous growth of Cu(200) grains.

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Microstructure and corrosion behavior of electrodeposited nanocrystalline nickel prepared from acetate bath

Cited by 10 publications

References 23 publications

Low current density electropolishing and corrosion resistance study of 304 stainless steel

Low current density electropolishing and corrosion resistance study of 304 stainless steel

The Contribution of Heteroatoms in Amide Derivatives with an Identical Structure on Nickel Electrodeposits

Effects of Organic Additives on Grain Growth in Electrodeposited Cu Thin Film during Self-Annealing

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