Microstructure and elemental distribution of multicrystal Ag/Cu interface in bimetallic strips with diffusion treatment

High-strength and high-conductive Cu/Ag multilayer produced by ARB

“…To date, various methods including cold drawing combined with intermediate heat treatments (thermomechanical processing) for Cu/Ag wires [7,8] roll-bonding and subsequent diffusion annealing of Cu and Ag strips [9] thin film deposition [10,11], nonequilibrium processes including rapid quenching, plasma processes [12,13] and severe plastic deformation methods like mechanical alloying [14,15] have been developed for the fabrication of Cu-Ag microcomposites.…”