Microstructure and Mechanical Properties of Co-Deposited Ti-Ni Films Prepared by Magnetron Sputtering

Abstract

Ti-Ni films with various Ni contents (16.5, 22.0, 33.5 at. %) were deposited on Al alloy substrates using DC magnetron co-sputtering. The effects of Ni target power and substrate bias (−10, −70, −110 V) on morphologies, crystallography, nanomechanical properties and scratch behavior of films were studied. All the deposited Ti-Ni films exhibited a BCC structure of β-Ti (Ni). The Ti-Ni films grew with a normal columnar structure with good bonding to substrates. When increasing the Ni target power and substrate bias, the grain size grew larger and the surface became denser. The as-deposited Ti-Ni films significantly improved the hardness (>4 GPa) of the Al alloy substrate. With the increase of bias voltage, the hardness and modulus of the film increased. The hardness and modulus of the Ti-22.0Ni film prepared at −70 V bias were 5.17 GPa and 97.6 GPa, respectively, and it had good adhesion to the substrate.

Optimization of Plating Process on Inner Wall of Metal Pipe and Research on Coating Performance

“…Electro-brush plating has been widely used in the preparation of coatings due to these advantages [ 19 , 20 , 21 , 22 , 23 , 24 , 25 , 26 , 27 ]. In addition, due to the excellent corrosion resistance, oxidation resistance in room temperature air, and no reaction with concentrated nitric acid, nickel has been widely used in electro-brush plating protection, repair, and remanufacturing technologies [ 28 , 29 , 30 , 31 , 32 , 33 ]. Nickel-based metals are well suited to the requirements of this study for the protection and performance enhancement of the inner pipe wall.…”