“…Besides the aforementioned process challenges in WAAM, the thermal gradient and solidification rate resulting from the relatively low heat input of the electric arc (Cunningham et al , 2018), in combination with the heat-sink effect of the substrate (Montevecchi et al , 2018), causes columnar grains to grow along the building direction. This textured microstructure results in anisotropic mechanical properties (Cunningham et al , 2018; Klein et al , 2022; Kok et al , 2018), which are undesirable for many engineering applications. Furthermore, during a layer-by-layer deposition in the WAAM process, the printed material experiences repeated thermal cycles, which cause both grain (Klein and Schnall, 2020) and secondary phase coarsening (Dong et al , 2020) and eventually affect the mechanical performance of the whole deposit (Jägle et al , 2016; Oyama et al , 2019; Rodrigues et al , 2019).…”