3rd Electronics System Integration Technology Conference ESTC 2010
DOI: 10.1109/estc.2010.5642852
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Microstructure and mechanical properties of laser ablation cleaned NiP platings for aluminum wire bonding

Abstract: Aluminum wire bonding to nickel surfaces is often used in automotive applications. For assurance of a high quality contact a clean substrate without any contaminants is required. In this study lead frame structures consisting of matte nickel, bright nickel and electrolytic deposited NiP (up to 0.5 m thickness) were used for Aluminum wire bonding. The lead frame was partially plated with tin at the connector end (opposite from the wire bonding surface). During the tin plating process an unintentional tin layer … Show more

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