Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size

Chen, Chuantong; Suganuma, Katsuaki

doi:10.1016/j.matdes.2018.11.062

Cited by 139 publications

(38 citation statements)

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“…The distinct shear strength can be explained by the coffee ring effect and the microstructures of the shear joints. The interfacial strength is governed by the microstructures on the interface [ 1 ]. The SEM images of the microstructures on the fractured surface are shown in Figure 4 d. The joints using aqueous-based Ag NPs possessed smaller connection areas due to the coffee ring effect.…”

Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

“…The attachment material plays an important role in the high-power electronic packaging applications, which can ensure the reliability and performance of devices [ 1 , 2 , 3 , 4 , 5 , 6 ]. Metal nanoparticles (NPs) have attracted growing attention in recent years owing to their unique characteristics such as low melting temperature and high diffusion coefficient, which differ from those of bulk materials [ 7 , 8 , 9 , 10 , 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

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A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Yan

2021

Nanomaterials

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Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb95Sn5 solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.

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Section: Interconnections Using Ag Np Pastesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Yan

2021

Nanomaterials

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“…In accordance with the substrate developments, dieattach materials are also required high thermal performance. Ag sinter bonding is hence emerging as a replacement of Pb-Sn solders, which has traditionally been used for power devices, with the remarkable thermal conductivity as well as superior thermal stability at high temperature operations [2][3][4][5][6]. These properties of Ag sinter die-attach are suitable for wide-bandgap semiconductors, and thus advanced high power modules are designed with Ag sinter bonding combined with the advanced substrate materials mentioned above.…”

Section: ⅰ Introductionmentioning

confidence: 99%

Thermal evaluation of metalized ceramic substrates for use in next-generation power modules toward international standardization

Wakasugi

Chen

Nagao

et al. 2020

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

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Wide bandgap (WBG) semiconductors such as SiC and GaN have opened their market as the next generation of high power modules. As advanced electronic power modules must deal with increasing power density, power modules with an insulating ceramic substrate are subjected to extremely high temperature due to high current and voltage. Currently, the junction temperature of Si power devices is kept low enough, around 150 ℃ , to maintain the module durability. Nevertheless, the temperature will be soon beyond 200 ℃ for WBG devices. Thus thermal dissipation performance has one of the key technologies in designing modules. Directly bonded copper (DBC) or aluminum (DBA) substrates have been widely used as two of the typical ceramic insulating substrates for high power modules. If the extensive heat from a junction is kept inside a module, the module will be easily damage due to the increasing temperature resulting in severe thermal stress inside. Designing a proper module structure requires not only each material property but also complex component shape/structure/layout including each interface heat transfer. An accurate measurement method of precise thermal properties for such a complex metallized ceramic substrates is currently still missing. To meet the urgent requests for the next generation of high power modules, a new and simple measurement method of the thermal properties has been proposed for complex metallized ceramic substrates. First we have designed a micro heater SiC chip as an accurate and controllable heat source instead of a SiC active die. The heater chip was die-attached on metallized ceramic substrate mimicking real module packaging structure. The thermal resistance of the metallized ceramic substrate was evaluated. Due to the high power of the chip, i.e. 1 kW/cm 2 , the obtained thermal resistance has an excellent accuracy within a few percent error, when adequate cooling system is used. The thermal resistance includes those of dieattach material and thermal interface materials (TIM). The developed method thus enables precise comparison in thermal properties of high power modules, which was proposed as an ISO standard.

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“…Recently, Ag paste just contains the micron-sized Ag flake particles shows a superior bonding performance even than that of the Ag hybrid paste [3]. Many researchers have observed in-situ nano-Ag particle generation in micron-sized Ag flake paste during sintering [4][5][6]. It can be attributed to the synergism effect of oxidization and reduction reaction of Ag, and release of micron strain in micron Ag flake particles [4].…”

Section: ⅰ Introductionmentioning

confidence: 99%

Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates

Chen

Zhang

Suganuma

2020

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

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Next generation power modules empowered by wide bandgap semiconductors like SiC and GaN can operate for a higher power than Si-based semiconductors at a high temperature over 250 ℃ . Ag sinter joining as a die attach material with a high melting point and good thermal conductive properties have obtained many attentions for the next generation power modules. This study investigated the bonding properties and the high temperature reliability of Ag sinter joining on ENEPIG (Electroless Ni plating (EN), Electroless palladium plating (EP) and immersion gold plating (IG)) metallized DBA substrates. The initial die shear strength for SiC (3x3 mm 2 ) power modules was 33.9 MPa at 250℃ sintering without assisted pressure in air conduction. The high temperature reliability of Ag sinter joint structure was evaluated at 250 ℃ aging for 1000 h. The Ag-Au interface bonding mechanism, fracture behaviors and microstructure evolution of sinter Ag-Au joint were systematically analyzed. In addition, the connected Ag particles change to coarse with pore size increase during the aging process. The Ag-Au interdiffusion layer also increased with the aging time but not clearly delamination occurrence. The die shear strength was slightly increased from the initial to 36.5 MPa after aging 1000 h, which meaning the Ag-Au joint possessed a good high temperature reliability. This study should add the understanding of the reliability issues of Ag sinter joining on Au finished substrate for its applications at high temperature.

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Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size

Cited by 139 publications

References 58 publications

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Thermal evaluation of metalized ceramic substrates for use in next-generation power modules toward international standardization

Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates

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