Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process

Chellvarajoo, Srivalli; Abdullah, M. Z.

doi:10.1016/j.matdes.2015.10.142

Cited by 70 publications

(36 citation statements)

References 42 publications

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“…Furthermore, the additions of NPs to the SAC solders lead to an enhancement of the shear strength, microhardness, wettability and of other properties. [9][10][11] In all these studies, it was shown that the additions of different kinds of NPs to the SAC solders lead, in principle, to similar effects. However, the behavior of the employed ceramic nanoinclusions in the Sn-based matrix is fundamentally different from that of metallic NPs: metal NPs are dissolved during the soldering process and act through an alloying effect while ceramic NPs act as nuclei for heterogeneous nucleation.…”

Section: Introductionmentioning

confidence: 99%

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Yakymovych

Švec

Orovčík

et al. 2017

Journal of Elec Materi

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This study investigates the effect of minor additions of Ni, Ni 3 Sn or Ni 3 Sn 2 nanoparticles on the microstructure and mechanical properties of Cu/solder/ Cu joints. The nanocomposite Sn-3.0Ag-0.5Cu (SAC305) solders with 0.5, 1.0 and 2.0 wt.% metallic nanoparticles were prepared through a paste mixing method. The employed Ni and Ni-Sn nanoparticles were produced via a chemical reduction method. The microstructure of as-solidified Cu/solder/Cu joints was studied by x-ray diffraction and scanning electron microscopy. The results showed that additions of Ni and Ni-Sn nanoparticles to the SAC305 solder paste lead initially to a decrease in the average thickness of the intermetallic compound layer in the interface between solder and substrate, while further additions up to 2.0 wt.% did not induce any significant changes. In addition, shear strength and microhardness tests were performed to investigate the relationship between microstructure and mechanical properties of the investigated solder joints. The results indicated an increase in both of these properties which was most significant for the solder joints using SAC305 with 0.5 wt.% Ni or Ni-Sn nanoparticles.

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Section: Introductionmentioning

confidence: 99%

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Yakymovych

Švec

Orovčík

et al. 2017

Journal of Elec Materi

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“…In order to improve the reliability and performance of the electronic assembly, various types of nanoparticles have been used as the reinforced material doped in the molten solder [1]. The presence of foreign element in lead free solder such as aluminum oxide (Al2O3), nickle oxide (NiO), and titanium dioxide (TiO2) have changed the mechanical properties and microstructure of the lead free solder [2,3,4]. Y. Tang et al found that the hardness value of reinforced solder with TiO2 nanoparticles increases by 34% [5] and wettability of the solder material was improved at 0.05-0.1 wt% nanoparticles [6].…”

Section: Introductionmentioning

confidence: 99%

Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

Mukhtar¹,

Abas

Haslinda

et al. 2018

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. This paper presents a preliminary study of the interaction between two models of numerical simulation namely volume of fluid (VOF) and discrete phase model (DPM). The multiphase-DPM model is capable of tracking the trajectory of the TiO2 nanoparticles that has been doped in the lead free solder Sn-3.0Ag-0.5Cu (SAC305). The current model was developed based on passive surface mount component 01005 capacitor that undergoes conventional reflow process. The trajectory of the nanoparticles at 0.01, 0.05 and 0.15wt% in the molten solder is shown in the flow front of the wetted molten solder. At 0.05wt% of nanoparticles, good dispersion of nanoparticles, pressure distribution and wetting time was found. The difference in wetting time are about 3.76% and 0.46% for 0.05wt% and 0.15wt% compared to 0.01wt% nanoparticle. The trajectory of the nanoparticles are shown to move along with the wetting formation of the molten solder. The pressure distribution and velocity vector of the different weight percentage of nanoparticles are also be studied. Higher pressure distribution is found at the capacitor area and intermetallic compound (IMC) region. The higher pressure distribution projected to reduce the micro void formation and optimize the reliability of the solder joint.

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“…In a Chellvarajoo et al study, they reengineered the composite SAC305 solder alloy by adding nanoparticles to enhance the reliability of the solder joint. They found the intermetallic compound (IMC) growth stunted by increasing the percentage of nanoparticles of iron nickel oxide (Fe 2 NiO 4 ) or nickel oxide (NiO) in the SAC305 solder matrix [10,11]. In addition, attempts have also been made in improving the solderability of SAC305 solder alloy in high temperature electronic applications by altering the joining methods through the utilization of an interlayer material in the soldering process, such as during the transient liquid phase (TLP) bonding process.…”

Section: Introductionmentioning

confidence: 99%

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Jamadon

Tan

Yusof

et al. 2016

Metals

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Abstract:The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi-pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 • C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 • C) and 54 MPa (at 300 s and 307 • C ), respectively. The fractography of the solder joint was analyzed by optical microscope (OM) and scanning electron microscopy (SEM). The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i) SAC305/Cu interface; (ii) inside SAC305 solder alloy; and (iii) inside porous Cu. Energy dispersive X-ray spectroscopy (EDX) was used to identify intermetallic phases. Cu 6 Sn 5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy.

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Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process

Cited by 70 publications

References 42 publications

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Nanocomposite SAC Solders: The Effect of Adding Ni and Ni-Sn Nanoparticles on Morphology and Mechanical Properties of Sn-3.0Ag-0.5Cu Solders

Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

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