Microstructure and mechanical properties of Sn-xGa alloys and solder joints

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

“…Specifically, hardness often conforms to the well-established Hall-Petch relationship, which correlates hardness with the inverse square root of grain size [29,30]. It is widely acknowledged the microstructure coarsens, mechanical properties such as hardness and strength tend to degrade [29][30][31][32][33]. Specifically, hardness often conforms to the well-established Hall-Petch relationship, which correlates hardness with the inverse square root of grain size [29,30].…”

“…This enhancement in solder strength was attributed to the refinement of matrix phases, aligning with the principles outlined in the Hall-Petch equation. Similarly, Zhang et al [33] demonstrated that Ga additions in Sn-XGa alloys (where X = 0.5, 1.0, 2.0 wt%) could moderately refine β-Sn grains while rendering the alloys more prone to recrystallization during cross-sectioning and polishing processes. Notably, Sn-1.0Ga exhibited significantly elevated yields and tensile strengths compared to pure Sn, attributed to the robust solid-solution strengthening effect of Ga and the refinement of β-Sn grains.…”

“…Conversely, the hardness value displayed a maximum at 40 IPL sessions, declining with escalating IPL irradiation counts. It is widely acknowledged that as the microstructure coarsens, mechanical properties such as hardness and strength tend to degrade [29][30][31][32][33]. Specifically, hardness often conforms to the well-established Hall-Petch relationship, which correlates hardness with the inverse square root of grain size [29,30].…”

Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints

“…Generally, the generation of a uniform and continuous interfacial IMC layer indicates a robust solder joint. However, these brittle IMCs, such as Cu 6 Sn 5 and Cu 3 Sn, coarsen excessively under thermal loads, which may lead to the formation of structural defects and reliability degradation of the micro-joint [12,13]. During the aging process of the SnAgCu/Cu joint, a Cu 3 Sn IMC layer forms and overgrows in the solid-state reaction, with the simultaneous emergence of Kirkendall voids [14].…”