Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates

Jin, Xiao; Tong, Xing; Liang, Jian; Chen, Quankun; Tang, Qiming

doi:10.1016/j.heliyon.2023.e12952

Cited by 4 publications

(4 citation statements)

References 34 publications

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“…As a result of the reaction, the amount of zinc in the solder alloy is greatly reduced [56]. Also, the formation of Cu 5 Zn 8 IMC was confirmed by Xiao et al [57]. This finding might explain that the γ-Cu 5 Zn 8 IMC forms as more copper atoms diffuse towards the ε-CuZn 5 precipitate through the aging time increment.…”

Section: Resultsmentioning

confidence: 72%

Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy

Shamaki,

Zahran,

Abd El-Rehim

2023

Crystals

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The aim of this research is to assess the influence of Sn inclusion on the microstructure evolution and age-hardening response of a Zn-4Cu alloy. This is the first study to correlate the age-hardening response to the microstructure of Zn-4Cu alloy reinforced with different Sn contents. A series of Zn-4Cu-Sn alloys were successfully fabricated with different Sn concentrations in the range of 0.0–4.0 wt.% using permanent mold casting. The microstructure of Zn-4Cu-Sn alloys was investigated by means of a scanning electron microscope (SEM) attached with an energy dispersive spectroscope (EDS) and X-ray diffraction (XRD) line profile analysis. At room temperature, the Vickers microhardness measurements were used to assess the age-hardening response of alloys. The results show that the microhardness of the Zn-4Cu (ZC) binary alloy increases a little bit from 76 to 80 HV as the aging time increases from 2 to 128 h, respectively. For aging times up to 16 h, the microhardness of all Sn-containing alloys decreases but then increases again. The lowest hardness belongs to the ZC-1.5Sn alloy, and the Sn-Zn-3.0Sn alloy has the highest; the other alloys fall somewhere in between. At high aging times (64 and 128 h), the microhardness of all Sn-containing samples increased continuously with an increasing Sn content from 0.0 to 3.0 wt.%. When the Sn-containing alloys (3.5 and 4.0 wt.% Sn) were aged for 64 and 128 h, the hardness declined by 7.94% and 8.90% compared to their peak aging hardness values, respectively. By considering the structural changes that occur in the Zn-4Cu-Sn alloys, the reasons for the observed variations in microhardness data with increasing Sn content and aging time were elucidated. X-ray diffraction (XRD) data was analyzed to determine the zinc matrix’s lattice parameters, c/a ratio, and unit cell volume variations.

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Section: Resultsmentioning

confidence: 72%

Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy

Shamaki,

Zahran,

Abd El-Rehim

2023

Crystals

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“…6 shows the results of TEM analysis of the interface between the Sn-1.5Ag-2.0Zn alloy solder and the polycrystalline copper substrate at 160 °C for 300 h. The selected electron diffraction pattern in the A region corresponds to Cu 6 Sn 5 with a crystalline band axis of [0 1 0]. The selected electron diffraction pattern in the C region corresponds to Cu 6 Sn 5 with a crystalline band axis of [ [2] , [3] , [4] , [5] , [6] , [7] , [8] , [9] , [10] , [11] , [12] ], and the selected electron diffraction pattern in the B region corresponds to Cu 5 Zn 8 with a crystalline band axis of [0−1 0]. It can be found that the rod-shaped particles A-phase Cu 6 Sn 5 and B-phase Cu 5 Zn 8 are grown in polycrystalline copper substrate nucleation.…”

Section: Results and Analysismentioning

confidence: 99%

“…It has been commonly used in the field of electronic packaging. However, the lead decomposed from tin-lead solder in electronic products pollutes the environment and threatens human health [ [1] , [2] , [3] , [4] , [5] , [6] ]. Moreover, the poor thermal workability and creep resistance of tin-lead solder cannot meet the requirements of packaging technology development.…”

Section: Introductionmentioning

confidence: 99%

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Xiao,

Cheng,

Fu-kang

2024

Heliyon

Self Cite

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“…At present, the solder used in PCB manufacture is mainly lead-free solder [5][6][7][8][9][10]. The most commonly used lead-free solders mainly include Sn-Ag [11][12][13][14], Sn-Cu [15][16][17][18], Sn-Zn [19][20][21][22], and Sn-Ag-Cu (SAC) [23][24][25].…”

Section: Introductionmentioning

confidence: 99%

Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock

Zhou

Chen

et al. 2023

Coatings

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Investigating the failure mechanism of solder joints under different temperature conditions is significant to ensure the service life of a printed circuit board (PCB). In this research, the stress and strain distribution of a PCB solder joint was evaluated by high- and low-temperature thermal shock tests. The cross-section of the solder joint after thermal shock testing was measured using a 3D stereoscopic microscope and SEM equipped with EDS. The microstructure of the lead-free solder joint and the phase of the intermetallic compound (IMC) layer were studied by XRD. The working state of the PCB solder joint under thermal shock was simulated and analyzed by the finite element method. The results show that thermal shock has a great effect on the reliability of solder joints. The location of the actual crack is consistent with the maximum stress–strain concentration area of the simulated solder joint. The brittle Cu6Sn5 and Cu3Sn phases at the interface accelerate the failure of solder joints. Limiting the growth of Cu6Sn5 and Cu3Sn phases can improve the reliability of solder joints to a certain extent.

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Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates

Cited by 4 publications

References 34 publications

Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy

Effect of Sn Addition on the Microstructure and Age-Hardening Response of a Zn-4Cu Alloy

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper

Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock

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