Microstructure and properties of AgCu/2 wt% Ag-added Sn–Pb solder/CuBe joints fabricated by vapor phase soldering

Liu, Wei; An, Rong; Ding, Ying; Wang, Chunqing; Tian, Yanhong; Shen, Kun

doi:10.1007/s12598-015-0545-y

Cited by 12 publications

(9 citation statements)

References 23 publications

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“…In this study, the basic SnPb systems were considered for analyze Ag addition effect. The addition of 2% silver (Ag) to the Sn-Pb solder had the effect of controlling the tin (Sn) and lead (Pb) leaching phenomenon in solder during thermal aging while also enhancing its mechanical properties [7,24]. Two different solder compositions were selected as shown in Table 1.…”

Section: Methodsmentioning

confidence: 99%

Growth of an Ag3Sn Intermetallic Compound Layer Within Photovoltaic Module Ribbon Solder Joints

Jeon

Kang

Shin

2019

Int. J. of Precis. Eng. and Manuf.-Green Tech.

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In this study, the characteristics of growing an intermetallic compound(IMC) layer at solder joint in photovoltaic (PV) ribbon solder joint were investigated through the thermal ageing test. Also, the growth rate of IMC in the ribbon solder joint, which depend on the temperature and time, was predicted through the ageing test. That the ageing test were performed under three different conditions: 90 °C, 120 °C and 150 °C. Also, we prepare the two type solder composition(60Sn40Pb, 62Sn2Ag36Pb) to analyze Ag addition effect in solder to forming IMC layer. Following testing, the IMC layer formed Ag 3 Sn in Ag sintered layer by Sn diffusion phenomena at high temperature. The thickness of Ag 3 Sn in solder joint was measured by cross-section images during the thermal ageing test. The Ag 3 Sn IMC layer was filled in sintered Ag layer in 70 h under the harshest conditions of 150 °C and 750 h at 120 °C. The Ag 3 Sn thicknesses were calculated to activation energies forming IMC layer in solder joints. The results, the Ag 3 Sn growth rates under the various temperatures were predicted for long-term reliability of PV modules.

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Section: Methodsmentioning

confidence: 99%

Growth of an Ag3Sn Intermetallic Compound Layer Within Photovoltaic Module Ribbon Solder Joints

Jeon

Kang

Shin

2019

Int. J. of Precis. Eng. and Manuf.-Green Tech.

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“…(6) is a predictor phase followed by two correction phases in Eq. 7and (8). The Sxδ 2 , Syδ 2 and Szδ 2 symbols are operators for central second difference with respect to the material inhomogeneity.…”

Section: Adi Scheme For Non-homogeneous Materialsmentioning

confidence: 99%

“…Applying Eq. (6), (7) and (8) along with the boundary conditions to all nodes using continuous indexing result in a system of simultaneous (implicit) equations in every phase. It can be expressed with matrices in the general from of A•T n+1 =B•T n +C, where double underline refers to square matrices and single underline represents column vectors.…”

Section: Adi Scheme For Non-homogeneous Materialsmentioning

confidence: 99%

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Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Bozsóki

Géczy

Illés

2019

International Journal of Heat and Mass Transfer

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In this paper the complex heat transfer process of the vapour phase soldering has been investigated on the level of electronic components. VPS is gaining increased attention lately, and the process needs different approach of modelling, compared to conventional soldering processes in electronics mass manufacturing. Component level modelling was not studied deeply in the literature before, so our focus pointed to heat transfer on large size surface mounted electronic components. Applying the Fourier type heat conduction equation, a detailed 3D thermal model of a polyester capacitor on a printed circuit board was implemented based on x-ray images of an actual assembly. Our model incorporates inner geometry, material inhomogeneity, composite materials and anisotropic thermal conductivity as important thermal features. Transient heating was calculated with Finite Difference Method combining an alternating direction implicit (ADI) approach, using averaged heat transfer coefficient. Validation measurements were taken in our VPS system. The measured data show good agreement with the calculation results and points to possible application for use in advanced engineering environment.

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“…Others showed that the microstructure of the joints formed in VPS ovens are dependent of the given setting of the soldering profile in vapours. [10][11]. Setting of this profile [12] or optimizations with statistical methods [13] were also investigated.…”

Section: Fig 1 Scheme Diagram Of Vps Ovenmentioning

confidence: 99%

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Géczy¹,

Alaya²,

Hantos

et al. 2018

2018 41st International Spring Seminar on Electronics Technology (ISSE)

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Vapour Phase Soldering (VPS) is a reflow soldering method used for special assemblies, where even heat distribution, uniform and high soldering quality is critical. To aim for the best joint quality, it is important to investigate the process and the state of the work zone. While VPS is a much more complex process than regular reflow methods, our paper aims to approach the monitoring of the work zone by novel and alternative paths, which can ultimately lead to a better control on the ovens, aiming for compliance with the zero defect manufacturing, and Industry 4.0 directives. For our work, two paths were defined. With the use of an infracamera, the possibility of quantitative optical observation was investigated, also the equalized temperatures of the measured board can be verified. With pressure sensing, the state of the vapour blanket can be investigated, which can lead ultimately to more reliable working cycles. The latter method shows promising results pointing to more refined process control; the former method shows limitations in the application within the field of VPS.

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Microstructure and properties of AgCu/2 wt% Ag-added Sn–Pb solder/CuBe joints fabricated by vapor phase soldering

Cited by 12 publications

References 23 publications

Growth of an Ag3Sn Intermetallic Compound Layer Within Photovoltaic Module Ribbon Solder Joints

Growth of an Ag3Sn Intermetallic Compound Layer Within Photovoltaic Module Ribbon Solder Joints

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

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