Microstructure and properties of Al/Cu bimetal in liquid–solid compound casting process

Hu, Yuan; Chen, Yiqing; Li, Li; Hu, Huan-dong; Zhu, Ziang

doi:10.1016/s1003-6326(16)64261-9

Cited by 52 publications

(21 citation statements)

References 32 publications

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“…The obtained eutectic phase diagram agrees well with the Al-rich side of the experimentally observed Al-Cu phase diagram [53], which describes the relationship between fcc-Al and the intermetallic phase Al 2 Cu (containing & 32.5 at% Cu [54]). Based on this phase diagram, the initial concentration À c of the supersaturated Al-Cu solid solution is set as 4.5%, and the quenched temperature r = 0.05 in all the simulations in this work.…”

Section: Computation Of the Al-cu Phase Diagram And Simulation Detailssupporting

confidence: 85%

Atomic-scale study of compositional and structural evolution of early-stage grain boundary precipitation in Al–Cu alloys through phase-field crystal simulation

et al. 2021

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Interfacial solute clustering is an essential step preceding grain boundary (GB) precipitation. Both states, i.e., clusters and precipitates, alter the mechanical, chemical, and corrosion properties of materials. Continuum models cannot capture the atomic details of these phenomena, specifically of the transition from clustering to precipitation. We thus use the structural phase-field crystal (XPFC) model to study the compositional and structural evolution during GB clustering in Al-Cu alloys. The results show that the compositional evolution is dominated by solute segregation to lattice defects at the very beginning and then by confined spinodal decomposition along the GBs. The latter leads to a steep increase in the concentration and then the formation of disordered clusters. This structure acts as a precursor for phase nucleation, just like the decomposed solid solution, and Guinier-Preston zones are the precursors of the thermodynamically stable Al 2 Cu phase in the interior of grains. Two modes of spinodal decomposition are found. (a) On low-angle tilt GBs, spinodal decomposition occurs at the dislocations that constitute the GB. (b) On high-angle tilt GBs, spinodal decomposition takes place inside the entire GB plane. In either case, the structural transition from the disordered low-dimensional precursor states to an ordered phase state takes place following the compositional enrichment. These results shed light on atomic-scale early-stage GB decomposition and precipitation processes in Al-Cu alloys and enrich our knowledge about the coupling effects between compositional and structural evolution during GB phase transformation phenomena.

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Section: Computation Of the Al-cu Phase Diagram And Simulation Detailssupporting

confidence: 85%

Atomic-scale study of compositional and structural evolution of early-stage grain boundary precipitation in Al–Cu alloys through phase-field crystal simulation

et al. 2021

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“…core filling continuous casting, CFC, which was reported by Zhang et al (2014)), and solid-liquid compound casting technology (SLCCT, e.g. horizontal continuous casting, HCC, which was reported by Hu et al (2016)). Among these methods, Zare et al (2013) reported that Cu-Al composites prepared by the SLCCT (i.e., through the interaction between liquid metal and solid metal in the contact interface to achieve a metallurgical bonding) have advantages of non-restriction in sample shape and size, good interfacial bonding strength, high economic efficiency and simple process.…”

Section: Introductionmentioning

confidence: 98%

Interfacial bonding mechanism and annealing effect on Cu-Al joint produced by solid-liquid compound casting

Chen

Dong

et al. 2018

Journal of Materials Processing Technology

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Copper-aluminum (Cu-Al) based lamellar composites were prepared using a solid-liquid compound casting (SLCC) technology. Characterization results showed that the Cu-Al composites were fully-sintered at 700 o C under an argon atmosphere using the SLCC technology. Cu-Al interfacial bonding was uniform with a well-defined transitional and inter-diffusion region. Intermetallic compounds and solid solutions of CuAl2, CuAl, Cu9Al4, CuAl3 and Cu3Al2 were detected at the interfacial region. With the increase of annealing temperature, the width of the Cu-Al interfacial region was increased, and the interfacial bonding strength was also increased, whereas the types of the intermediate phases were changed. With the increase of dwelling time at a given annealing temperature, the width of Cu-Al interfacial region was increased, the interfacial bonding strength was decreased and the mesophases were changed. The bonding strength of the as-prepared composite was 30 MPa, whereas those of specimens annealed at 200 o C for 2 hours, 300 o C for 2

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“…A diffusion layer will form between the two materials, generating continuous metallurgical bonding. 13 A similar process, named composite casting or discontinuous compound casting, has gained much attention. In this process, a metal is first cast into the mold.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure Formation in Al7SiMg/Cu Compound Castings

et al. 2020

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Compound casting is an attractive approach to create multi-material components and thus reduce the overall weight, while maintaining both the functional and mechanical properties. In this work, Al7SiMg alloy/copper compound castings were produced by a low-pressure die casting process. A flux coating was applied on copper pipes to reduce the oxide layer present in the interface between Al and Cu. The interface layer formed between the two alloys was investigated using optical microscopy, scanning electron microscopy and energy-dispersive X-ray spectroscopy. Vickers micro-hardness was also measured across the interface. Results showed that a continuous metallurgical bond formed between copper and aluminum without use of surface treatment. In the bond layer, various Al-Cu intermetallic phases were detected, as well as primary silicon particles and the quaternary phase Al 5 Cu 2 Mg 8 Si 6. Flux coating prevented formation of any metallic bond between copper and aluminum. Instead, high concentrations of potassium, magnesium and fluorine, indicative of formation of KMgF 3 and MgF 2 , were detected in the interface. The mechanism for the formation of the intermetallic phases and the strength of the interface layer have been discussed.

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Microstructure and properties of Al/Cu bimetal in liquid–solid compound casting process

Cited by 52 publications

References 32 publications

Atomic-scale study of compositional and structural evolution of early-stage grain boundary precipitation in Al–Cu alloys through phase-field crystal simulation

Atomic-scale study of compositional and structural evolution of early-stage grain boundary precipitation in Al–Cu alloys through phase-field crystal simulation

Interfacial bonding mechanism and annealing effect on Cu-Al joint produced by solid-liquid compound casting

Interfacial Microstructure Formation in Al7SiMg/Cu Compound Castings

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