Microstructure and properties of cold-drawn Cu and Cu-Fe alloy wires

Yang, Fei; Zhang, Xiaodan; Fang, Feng

doi:10.1088/1757-899x/1249/1/012057

Cited by 11 publications

(3 citation statements)

References 12 publications

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“…Meanwhile, Ce or Ti can improve the oxidation resistance and bondability of Cu alloy wire [ 79 ]. Yang et al [ 80 ] drew the Cu and Cu-Fe alloy wires at room temperature, and the properties were characterized and analyzed. The results show that the strength and ductility of Cu-Fe wires are higher than those of Cu wire under the same drawing strain.…”

Section: Cu Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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Section: Cu Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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“…Although pure copper has excellent electrical and thermal conductivity and corrosion resistance, its strength and hardness are low. Improving its mechanical properties without reducing the electrical conductivity is one of the key challenges in the preparation of ultrafine and high-performance copper wires [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Processing and Properties of Single-Crystal Copper Wire

Cao,

Wu,

et al. 2023

Micromachines

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The effects of drawing parameters and annealing process on the properties and microstructure of single crystal copper wire are studied using a wire-drawing machine, heat-treatment equipment, microcomputer-controlled electronic universal tester, resistance tester, and scanning electron microscope. The results show that, after drawing the single-crystal copper wire with a single-pass deformation of 14%, the grains elongate along the tensile direction, tensile strength increases from 500.83 MPa to 615.5 Mpa, and resistivity changes from 1.745 × 10−8 Ω·m to 1.732 × 10−8 Ω·m. After drawing at a drawing rate of 500 m/min, the degree of grain refinement increases and tensile strength increases from 615.5 Mpa to 660.26 Mpa. When a copper wire of Φ0.08 mm is annealed, its tensile strength decreases from 660.26 Mpa to 224.7 Mpa, and elongation increases from 1.494% to 19.87% when the annealing temperature increases to 400 °C. When the annealing temperature increases to 550 °C, the tensile strength and elongation decrease to 214.4 MPa and 12.18%, respectively.

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“…[9,10]. It has been reported that the mechanical and functional properties of the Cu-Fe binary alloys could be well controlled by adjusting the Fe phase content [2,11,12]. For instance, increasing the Fe content from 5 wt.% to 70 wt.% in Cu-Fe alloys resulted in a strength increase from 305 MPa to 736 MPa [13].…”

Section: Introductionmentioning

confidence: 99%

Mechanical and Corrosion Behavior of a Composite Gradient-Structured Cu-Fe Alloy

Guan

et al. 2023

Metals

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Immiscible Cu-Fe alloys exhibit poor corrosion resistance due to different corrosion potentials between the constituent phases, which limits their application. In this paper, a composite gradient-structured Cu-10 wt.%Fe plate was prepared via the ultrasonic surface rolling process (USRP). The microstructure evolution, mechanical properties and corrosion behavior were studied. The results demonstrate that USRP effectively enhances both the strength and corrosion resistance of the Cu-10Fe alloy. The improved strength is related to the combined effects of Hall–Petch strengthening, dislocation strengthening, and additional strengthening resulting from homogeneous deformation between the surface layer and the matrix. The enhanced corrosion resistance is primarily attributed to the refined microstructure of the surface layer after USRP, which facilitates the formation of a protective passivation film.

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Microstructure and properties of cold-drawn Cu and Cu-Fe alloy wires

Cited by 11 publications

References 12 publications

Research Progress on Bonding Wire for Microelectronic Packaging

Research Progress on Bonding Wire for Microelectronic Packaging

Processing and Properties of Single-Crystal Copper Wire

Mechanical and Corrosion Behavior of a Composite Gradient-Structured Cu-Fe Alloy

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