Microstructure and properties of polyamideimide/silica hybrids compatibilized with 3-aminopropyltriethoxysilane

Son, Minsoo; Ha, Youri; Choi, Myeon‐Cheon; Lee, Tae-Sung; Han, Dong-Hee; Han, Se-Won; Ha, Chang‐Sik

doi:10.1016/j.eurpolymj.2008.04.037

Cited by 28 publications

(16 citation statements)

References 36 publications

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“…The silica network has the tendency to agglomerate into large particles affecting the properties of the materials, especially the mechanical properties. 23 A way to improve the compatibility between polyimide and silica is by functionalizing the polymer chains at their ends, including comonomers that contain appropriate functional groups or adding a coupling agent to bond the polyimide chains and DOI 10.1007/s13233-011-0311-4 *Corresponding Author. E-mail: chamciuc@icmpp.ro inorganic oxide network.…”

Section: Introductionmentioning

confidence: 99%

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Hamciuc¹,

Hamciuc²,

Okrasa

2011

Macromol. Res.

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Hybrid films containing silica were prepared using a poly(amic acid) incorporating polydimethylsiloxane segments and tetraethoxysilane via a sol-gel technique and thermal cyclodehydration. The surface morphology of the films was examined by atomic force microscopy and scanning electron microscopy. The free surface energy was evaluated based on contact angle measurements. The films were flexible and showed good mechanical properties. They exhibited high thermal stability with an initial decomposition temperature above 420 o C and a glass transition temperature in the range of 216-223 o C. Dielectric spectroscopy revealed primary α 1 relaxation due to the polydimethylsiloxane segments, and three subglass transitions: γ, β 1 and β 2 . At higher temperatures, α 2 -relaxation that corresponds to the upper glass transition and a conductivity process appeared. The influence of the silica content on the hybrid film properties was examined. Dynamic mechanical analysis revealed similar relaxation processes to those observed by dielectric spectroscopy.

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Section: Introductionmentioning

confidence: 99%

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Hamciuc¹,

Hamciuc²,

Okrasa

2011

Macromol. Res.

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“…PAI was selected due to its high melting temperature and high corrosion resistance. This particular polymer is also known to adhere well to metals [7,8]. The effects of the incorporated carbon black on the corrosion resistance and the through-plane contact resistance of the specimens were investigated.…”

Section: Introductionmentioning

confidence: 99%

Electrical and corrosion properties of stainless steel bipolar plates coated with a conduction polymer composite

Lee

Lim

2010

Current Applied Physics

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“…Polyamide-imide (PAI) is a kind of high-performance thermoplastic resin.It isused for advanced applications, such as in the electrical, aerospace, automobile and energy fields in the form of adhesives, composite materials and coating materials, related to their combinationof high toughness, high thermal stability, high glass transition temperature and enhanced chemical resistance [1][2][3][4][5]. Polyamide-imide can be obtained from different strategies of synthesis.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and curing process of TMA-MDI polyamide-imides

et al. 2017

MATEC Web Conf.

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Abstract. The influence of molecular ratio of monomers, reaction time, reaction temperature and solid content on the molecular weight of polyamide imides(PAI), heating rate, temperature and time on tensile properties of PAI film was investigated in detail. The results showed that when monomer molar ratio (MDI: TMA)R >1, PAI is an isocyanate terminated, intrinsic viscosity increases with the increase of R, reaches maximum value at R=1.06, then it decreases obviously. Contrarily, when R <1, PAI is terminated with anhydride, intrinsic viscosity increases with the decrease of R, its maximum value at R= 0.97, then it decreases with the decrease of R. The relation between intrinsic viscosityof PAI and reaction temperature, reaction time, solid content all follows the parabolic law. The optimal reaction temperature,reaction time, solid content is 140℃, 120 min, 30%. Therefore, the best synthesis process of the PAI is reacting for 120 min at 140℃ when 30% solid content and R=1.06. Tensile strength and elongation increase with the increase of heating rate, curing temperature and curing time, after peak value, they decrease with the increase of heating rate, curing temperature andcuring time. The best curing process of the PAI is curing for 2h at 260℃and heating rate 100℃/h.

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Microstructure and properties of polyamideimide/silica hybrids compatibilized with 3-aminopropyltriethoxysilane

Cited by 28 publications

References 36 publications

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Electrical and corrosion properties of stainless steel bipolar plates coated with a conduction polymer composite

Synthesis and curing process of TMA-MDI polyamide-imides

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