Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

“…The parameters λ IMC and λ s , which can be theoretically and numerically determined, are the order of displacement singularity at the corner of the IMC grain and the solder joint, respectively. This size effect was suggested to be valid in solder joints with scallop-type IMCs [56][57][58][59], as shown in Figure 9.…”

“…They found that the solder joints with a small d/t were apt to fracture at the middle of the solder layer, while the joints with a large d/t tended to fracture at the solder/IMC interface. Wang et al [56] developed a theoretical model based on the local stress singularity at the bi-material corner to analyze the relationship between the microstructure size and macro-fracture toughness of lead-free solder joints. The IMC grain size effect on the fracture toughness of solder joints was stated as follows [34]:…”

“…2019, 9, x FOR PEER REVIEW 11 of 15 Figure 9. IMC grain size effect on the fracture toughness of solder joints [56]. (Reused with permission).…”

A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading

“…To meet the increasing demand of small size and low cost of electronic device, advanced electronic packaging technology, such as system in packaging (SiP) has become one of the promising technologies for More than Moore at least for next one to two decades 1,2 . Fatigue behaviors of the interconnect material such as solder in SiP are critical for yield in processes and reliability in testing and operation, which are strongly affected by the material microstructures 3,4 . As a result, investigation into the effects of solder microstructure on the fatigue behaviors is important for the development of SiP, which can lead to more accurate life prediction and optimized design for the material selection and component structure in SiP 5…”

“…1,2 Fatigue behaviors of the interconnect material such as solder in SiP are critical for yield in processes and reliability in testing and operation, which are strongly affected by the material microstructures. 3,4 As a result, investigation into the effects of solder microstructure on the fatigue behaviors is important for the development of SiP, which can lead to more accurate life prediction and optimized design for the material selection and component structure in SiP. 5 When operating in service conditions, solder joint mainly undergoes combined creep and fatigue failure due to the thermal mismatch between different components in electronic device.…”