2009
DOI: 10.1016/j.jmatprotec.2008.02.035
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Microstructure and tensile behavior of multiply needled C/SiC composite fabricated by chemical vapor infiltration

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Cited by 62 publications
(18 citation statements)
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“…8 Accumulated energy with strain and time 无 机 材 料 学 报 第 35 卷 图 9 累积事件数随应变和时间的变化 Fig. 9 Accumulated number of AE events with strain and time 阶段 [25] , 但通过声发射研究方法, 即使在损伤起始 阶段仍有明显的微观断裂事件。 此阶段声发射事件 以基体微裂纹扩展、 热解炭界面损伤和单丝纤维断 裂等低能声发射信号为主。C/SiC 复合材料在制备 过程中会产生热应力, 同时微结构内的孔隙也会 成为裂纹源 [30][31] , 并在较低应力下扩展。加载开始 时, 材料残余热应力释放, 当局部应力超过 SiC 基 体的承载能力后, SiC 基体孔隙作为裂纹源产生微 裂纹并扩展, 同时随着应力的增大, 在低强度的 SiC 区域开始出现基体裂纹 [32] 。由于纤维对基体微 裂纹扩展有阻隔作用, 裂纹沿着界面产生偏转, 发 生界面脱粘 [30] , 如图 7(c)所示。同时纤维束中少量…”
Section: 材料损伤演化分析unclassified
“…8 Accumulated energy with strain and time 无 机 材 料 学 报 第 35 卷 图 9 累积事件数随应变和时间的变化 Fig. 9 Accumulated number of AE events with strain and time 阶段 [25] , 但通过声发射研究方法, 即使在损伤起始 阶段仍有明显的微观断裂事件。 此阶段声发射事件 以基体微裂纹扩展、 热解炭界面损伤和单丝纤维断 裂等低能声发射信号为主。C/SiC 复合材料在制备 过程中会产生热应力, 同时微结构内的孔隙也会 成为裂纹源 [30][31] , 并在较低应力下扩展。加载开始 时, 材料残余热应力释放, 当局部应力超过 SiC 基 体的承载能力后, SiC 基体孔隙作为裂纹源产生微 裂纹并扩展, 同时随着应力的增大, 在低强度的 SiC 区域开始出现基体裂纹 [32] 。由于纤维对基体微 裂纹扩展有阻隔作用, 裂纹沿着界面产生偏转, 发 生界面脱粘 [30] , 如图 7(c)所示。同时纤维束中少量…”
Section: 材料损伤演化分析unclassified
“…In the same work, stitched carbon fiber fabrics processed in the same way exhibited a Young's modulus of 62-64 GPa. Nie et al (2009) also found a Young's modulus of 75±4 GPa for a needled carbon fiber densified with a SiC matrix, obtained by the CVI technique. These properties can be compared with those shown in Table 5 and Table 6.…”
Section: From Input Parameters Frommentioning
confidence: 65%
“…The reaction temperature of chemical vapor infiltration was 1100°C, the reaction time was 30 h, and the molar ratio of H 2 to CH 3 SiCl 3 was 1 : 10. The final density of C/SiC composites was 2.1 cm 3 / g. More details of the chemical vapor infiltration preparation process of unidirectional C/SiC composites can be obtained from literature [25]. The fibers were approximately cylindrical and the interface was obvious, Figure 2a.…”
Section: Materials Design and Preparationmentioning
confidence: 99%