Microstructure effects on thermal and electrical conductivities in the intermetallic compound Ag$$_{3}$$Sn-based materials, sintered by SPS in view of die-attachment applications

The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag5Sn0.9

“…A surface stabilizer, PVP (Alfa Aesar), was used to prevent particles from coalescing. A distillation device [21] was chosen to achieve a lower hydrolysis rate and obtain the metallic particles. Note that all the chemical products were used as received, without any further purification.…”

“…The synthesis was carried out using a distillation assembly comprising a heating mantle, a temperature probe, a temperature regulator, a three-necked flask, a stirring shaft and a distillation column [21]. A volume of 200 mL of EG was poured into a 500 mL threenecked flask.…”

“…Ag 3 Sn and ζ-phases can be good candidates in the sintering process for interconnection in electronic power devices. Indeed, these compounds have relatively high melting points of 480 • C and 724 • C, respectively, which offer a thermal stability at different operating temperatures, and, at the same time, their electric and thermal properties are close to those of the eutectic alloy Sn-3.5Ag as well as several lead-free alternatives frequently used in the market [1,20,21]. Additionally, when comparing their melting points with that of silver (914 • C), lower processing temperatures are more likely possible.…”