2019
DOI: 10.1016/j.apsusc.2019.04.142
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Microstructure evolution and corrosion resistance of Ni–Cu–P amorphous coating during crystallization process

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Cited by 51 publications
(18 citation statements)
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“…Figure 15a shows that duplex coating has a higher corrosion potential than uncoated samples, indicating significant protection against corrosion. Again, the system with Ni-Cu-P as the outer layer of deposition (Coating-1) displays a passivation phase in the polarization curve, as was also reported by Chen et al [41]. This leads to the conclusion that the performance of Coating-1 is relatively better compared to the system with Ni-P as the outer layer (Coating-2).…”
Section: Corrosion Behaviorsupporting
confidence: 75%
“…Figure 15a shows that duplex coating has a higher corrosion potential than uncoated samples, indicating significant protection against corrosion. Again, the system with Ni-Cu-P as the outer layer of deposition (Coating-1) displays a passivation phase in the polarization curve, as was also reported by Chen et al [41]. This leads to the conclusion that the performance of Coating-1 is relatively better compared to the system with Ni-P as the outer layer (Coating-2).…”
Section: Corrosion Behaviorsupporting
confidence: 75%
“…Recently, Ni-based coatings have been widely used for preventing corrosion damage on substrates, Tang et al 2 fabricated a Ni-Co coating by electroplating, which effectively improved the corrosion resistance of X65 steel in a sweet (CO 2 ) corrosion environment. Chen et al 3 prepared a Ni-Cu-P coating by electroless plating, which showed better corrosion performance than low-carbon steel in a 3.5 wt% NaCl solution. Jime´nez et al 4 demonstrated that a thermal-flamesprayed Ni-Tec coating had a lower corrosion current and more positive corrosion potential than gray cast iron.…”
Section: Introductionmentioning
confidence: 99%
“…4 Cu incorporated in EN coating enhances its brightness/smoothness, thermal and paramagnetic stability, and anti-corrosion properties. [5][6][7][8] Cu into EN coating prompts to decrease the nodule size, and the coating appears to be smooth and lustrous compared to the conventional Ni-P coating. 9 Moreover, Cu represses Ni reduction, which reduces the coating deposition rate.…”
Section: Introductionmentioning
confidence: 99%