Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding

Abstract

Purpose This paper used a novel technique, which is thermo-compression bonding, and Sn-1.0Ag-0.5Cu solder to form a full intermetallic compound (IMC) Cu3Sn joints (Cu/Cu3Sn/Cu joints). The purpose of the study is to form high-melting-point IMC joints for high-temperature power electronics applications. The study also investigated the effect of temperature gradient on the microstructure evolution and the growth behavior of IMCs. Design/methodology/approach In this paper, the thermo-compression bonding technique was used to form full Cu3Sn joints. Findings Experimental results indicated that full Cu/Cu3Sn/Cu solder joints with the thickness of about 5-6 µm are formed in a short time of 9.9 s and under a low pressure of 0.016 MPa at 450°C by thermo-compression bonding technique. During the bonding process, Cu6Sn5 grew with common scallop-like shape at Cu/SAC105 interfaces, which was followed by the growth of Cu3Sn with planar-like shape between Cu/Cu6Sn5 interfaces. Meanwhile, the morphology of Cu3Sn transformed from a planar-like shape to wave-like shape until full IMCs solder joints were eventually formed during thermo-compression bonding process. Asymmetrical growth behavior of the interfacial IMCs was also clearly observed at both ends of the Cu/SAC105 (Sn-1.0Ag-0.5Cu)/Cu solder joints. Detailed reasons for the asymmetrical growth behavior of the interfacial IMCs during thermo-compression bonding process are given. The compound of Ag element causes a reduction in Cu dissolution rate from the IMC into the solder solution at the hot end, inhibiting the growth of IMCs at the cold end. Originality/value This study used the thermo-compression bonding technique and Sn-1.0Ag-0.5Cu to form full Cu3Sn joints.

Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints

“…Cu 6 Sn 5 and Su 3 Sn grow one after another, and the IMC layer thickness gradually increases. Since the Cu 3 Sn phase generated requires more activation energy [34], the Cu 6 Sn 5 grows much faster than the Cu 3 Sn. The Ag atoms themselves will generate the Ag 3 Sn phase with the solder.…”

Cu3Sn-microporous copper composite joint for high-temperature die-attach applications

“…However, an appropriate die-attach material is still being sought that can take full advantage of the excellent properties of SiC at high temperatures. At present, the most commonly used high-temperature die-attach connection methods are high temperature solder alloys, sintering of nanopowders and transient liquid phase (TLP) (Bajwa et al , 2015; Kang et al , 2020; Guo et al , 2019; Kisiel and Szczepański, 2009).…”