Microstructure evolution and mechanical properties of Cu-Sn intermetallic joints subjected to high-temperature aging

Zhang, Hu; Li, Xiaoyan; Yao, Peng; Wen, Linjie; Zhu, Yangyang; He, Xi; Yang, Gangli

doi:10.1016/j.matchar.2022.111791

Cited by 11 publications

(3 citation statements)

References 24 publications

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“…Since α(Cu) is a solid solution of Cu, it maintains the same lattice as Cu. Therefore, Cu 3 Sn with orthorhombic structure, Cu 41 Sn 11 with cubic structure and Cu with the cubic structure were applied in the EBSD analysis (Zhang et al , 2022).…”

Section: Resultsmentioning

confidence: 99%

“…However, some literature shows that Cu 3 Sn transforms into Cu 41 Sn 11 when the aging temperature exceeds 350°C (Liu, et al , 2018). In addition, according to the Cu−Sn binary alloy phase diagram, Cu 20 Sn 6 or Cu solid solution phases may be generated when the Cu−Sn solder joints are subjected to higher temperature aging (Bosco and Zok, 2005; Zhang, et al , 2022). The aforementioned indicates that the Cu 3 Sn solder joints are unstable at high temperatures.…”

Section: Introductionmentioning

confidence: 99%

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Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu₃Sn/Cu solder joint

Yang

Han

et al. 2022

SSMT

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Purpose This study aims to analyse the changes in the microstructure and grain orientation of the full Cu3Sn solder joint (Cu/Cu3Sn/Cu) during isothermal aging at 420°C. Design/methodology/approach The Cu3Sn solder joint was fabricated through soldering Cu/Sn/Cu structure and then aged at 420°C. The microstructure evolution and grain orientation were studied by observing the cross-section and top-view surfaces of solder joints. Findings Original Cu3Sn solder joint initially transformed into the full Cu41Sn11solder joint (Cu/Cu41Sn11/Cu) at 10 h and finally into the full α(Cu) solder joint (Cu/α(Cu)/Cu) at 150 h during aging. Micro-voids formed in the center of the solder joint interface during the conversion of Cu41Sn11to α(Cu), resulting in lower reliability of the solder joint. Cu3Sn and Cu41Sn11 grains presented a column-like shape, while α(Cu) presented an irregular shape. The average grain sizes of interfacial phases first increased and then decreased during aging. Original Cu3Sn solder joint exhibited two main textures: [100]//TD and [203]//TD. For Cu41Sn11, the preferred orientation of [111]//TD was found in the early nucleation stage, while the orientation of the formed full Cu41Sn11 solder joint was dispersed. Furthermore, α(Cu) grains exhibited {100}<100> preferred orientation. Originality/value Few researchers focused on the process of microstructure and grain orientation changes during high-temperature (> 300°C) aging of Cu3Sn solder joint. To bridge the research gap, a high-temperature aging experiment was conducted on Cu3Sn solder joints.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu₃Sn/Cu solder joint

Yang

Han

et al. 2022

SSMT

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“…Thus, in general, in all alloys, copper and inclusions based on it undergo oxidation. Due to more intense friction in the AA4 alloy, an intermetallic compound, Cu 3 Sn, was found, which, according to Franke et al, is formed according to the following Formula (1) [45]:…”

Section: Xps Analysismentioning

confidence: 99%

Study of Adaptation Processes in Tribofilms during Friction of Antifriction Aluminum Alloys for Journal Bearings

Podrabinnik,

Gershman,

Mironov

et al. 2023

Metals

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This paper provides results on the tribological behavior of experimental Al–Sn–Pb–Si–Cu–Mg–Zn aluminum alloys and describes the adaptation phenomena that reduce wear intensity during friction with steel. The main focus is on tribofilm formation, which plays an important role in friction energy dissipation. The alloys were tested in a rig imitating a journal-bearing shaft couple, and the friction surfaces were studied by the scanning electron microscopy, energy-dispersive analysis and X-ray photoelectron spectroscopytechniques. Based on the analysis, a conclusion on processes and tribochemical reactions was made. Compared to the initial state, eight new compounds were found on the friction surface. In the most wear-resistant alloy, magnesium precipitated from a solid solution with the subsequent oxidation. The same process was detected for zinc in the least wear-resistant alloy due to its low magnesium content. Furthermore, CuSn3 and PbS compounds, which require >600 °C temperature to compose, were found in tribofilms, indicating that the rubbing body lost thermodynamic equilibrium during friction. The revealed processes are non-spontaneous and decrease the wear intensity of the alloys, as they are accompanied by negative entropy production and dissipation of friction energy. Stepwise depth XPS analysis also showed the functional levels of the tribofilms.

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Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process

Zhou

et al. 2023

J Mater Sci: Mater Electron

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Microstructure evolution and mechanical properties of Cu-Sn intermetallic joints subjected to high-temperature aging

Cited by 11 publications

References 24 publications

Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu₃Sn/Cu solder joint

Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu₃Sn/Cu solder joint

Study of Adaptation Processes in Tribofilms during Friction of Antifriction Aluminum Alloys for Journal Bearings

Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process

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Microstructure evolution and mechanical properties of Cu-Sn intermetallic joints subjected to high-temperature aging

Cited by 11 publications

References 24 publications

Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint

Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint

Study of Adaptation Processes in Tribofilms during Friction of Antifriction Aluminum Alloys for Journal Bearings

Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process

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Product

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Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu₃Sn/Cu solder joint

Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu₃Sn/Cu solder joint