Microstructure evolution and reaction behavior of Cu–Ni–Si powder system under solid-state sintering

Jia, Lei; Yang, Ming-fang; Tao, Shan; Xie, Honglan; Lu, Zhenlin; Kondoh, Katsuyoshi; Xing, Zhiguo

doi:10.1016/j.matchemphys.2021.124942

Cited by 8 publications

(3 citation statements)

References 29 publications

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“…When heat treatment and machining is used, the alloy is easy to crack during rolling and forging. However, the powder metallurgy method can effectively avoid the occurrence larger of Ni and Si compounds, and in recent years, it has been reported that Cu-Ni-Si alloy materials were prepared by powder metallurgy [18][19][20][21][22].Compared with literature [21,22], this paper not only cancelled the Ar protection measures in the ball milling process, but also reduced the ball milling speed and shortened the ball milling time. On the other hand, when the Cu content was reduced and Ni and Si were increased, the electrical conductivity of Cu-Ni-Si alloy does not decrease, but the mechanical properties of the alloy were improved by 12.1%.…”

Section: Introductionmentioning

confidence: 93%

Effect of high contents of nickel and silicon on the microstructure and properties of Cu–Ni–Si alloys

Tao¹,

Lu²,

Xie³

et al. 2022

Mater. Res. Express

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Cu-Ni-Si alloys have been widely used in electronics and electrical industries.The preparation method of alloy was not limited to smelting, powder metallurgy method has also attracted the attention of many researchers. In this study, Cu-Ni-Si alloys were prepared using hot-pressed sintering and elemental copper powders, in which nickel and silicon powders were used as raw materials. The results show that, when the Cu-Ni-Si alloys were prepared using hot-pressed sintering, there were no Ni-Si intermetallic compounds except the δ-Ni2Si phase in the microstructure of alloys. After the ageing treatment, when the mass ratios of Ni/Si were 2:1 and 3:1, the precipitation of δ-Ni2Si phase was significantly less. However, when the mass ratios of Ni/Si were 4:1 and 5:1, the precipitation of δ-Ni2Si phase particles increased significantly. The results from electrical conductivity and Vickers hardness show that, after the ageing treatment, both the electrical conductivity and Vickers hardness of the alloys greatly improved.

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Section: Introductionmentioning

confidence: 93%

Effect of high contents of nickel and silicon on the microstructure and properties of Cu–Ni–Si alloys

Tao¹,

Lu²,

Xie³

et al. 2022

Mater. Res. Express

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“…Their electrical and mechanical properties are similar and comparable to copper-beryllium alloys. These alloys are also used in the aviation and electronics industries [15,[21][22][23][24][25][26].…”

Section: Introductionmentioning

confidence: 99%

Thermoplastic hardened Cu-Ni-Si-Ag alloy

Krupińska,

Chulist,

Kondracki

et al. 2023

Bulletin of the Polish Academy of Sciences Technical Sciences

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The paper aims to investigate the influence of silver addition on the microstructure of CuNi2Si1 alloys. The investigated copper alloy was cast and then supersaturated, plastically deformed on the Gleeble 3800 simulator and finally aged. Structural changes were examined using optical microscopy, scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Orientation mapping was completed with FEI Quanta 3D field emission gun scanning electron microscope (SEM) equipped with TSL electron backscattered diffraction (EBSD) system. The effect of structural and microstructural changes on hardness and conductivity was also investigated. Based on the mechanical tests it was found that the mechanical properties and conductivity are improved due to heat and plastic treatment. It was also found that the precipitation hardening raises the hardness to the level of 40% whilst an increase in conductivity by 20% is observed.

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“…In particular, high-strength and highconductivity copper alloys have become indispensable core materials in high-tech fields and are widely used in various energised product parts [3]. With the rapid development of modern industry and the information industry in particular, energised products are becoming increasingly miniaturised and lightweight, and the requirements for electrical conductivity, thermal conductivity, and load-bearing properties are constantly increasing; consequently, it is urgent to upgrade copper alloys [4][5][6]. Among the series of developed alloys, Cu-Ni-Si alloys are considered some of the most promising high-strength and high-conductivity materials owing to their high strength and conductivity and good hot and cold workability [7][8][9][10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Effect of multiple forging on the microstructure and properties of an as-cast Cu–Ni–Si alloy with high Ni and Si contents

Zhang

Jia

et al. 2021

Mater. Res. Express

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A Cu–Ni–Si alloy with high Ni and Si contents was prepared by the traditional melting and casting method, and then multiple forging and ageing were conducted to investigate their effect on the microstructure and properties. The results show that reticular Ni31Si12 phases are located on the grain boundaries of the dendritic α-Cu(Ni,Si) solution matrix in the as-cast Cu–Ni–Si alloy because of the high Ni and Si contents, and some rice-like Ni2Si phases precipitate in the interior of α-Cu(Ni,Si) grains during cooling. With increasing number of forging passes, the morphology of the α-Cu(Ni,Si) matrix changes from dendrites to elongated dendrites and then equiaxed grains, the Ni31Si12 phase changes from reticular to irregular and then particle-like, while the Ni2Si phase gradually disappears. As a result, the hardness increases continuously up to 18 forging passes, while the electrical conductivity first increases and then decreases significantly. The hardness and electrical conductivity achieve the highest values with 18 forging passes and a subsequent ageing treatment at 450 °C for 4 h, and the corresponding microstructure comprises an equiaxed α-Cu(Ni,Si) matrix with microscale Ni31Si12 particles and sub-microscale Ni2Si precipitates.

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Microstructure evolution and reaction behavior of Cu–Ni–Si powder system under solid-state sintering

Cited by 8 publications

References 29 publications

Effect of high contents of nickel and silicon on the microstructure and properties of Cu–Ni–Si alloys

Effect of high contents of nickel and silicon on the microstructure and properties of Cu–Ni–Si alloys

Thermoplastic hardened Cu-Ni-Si-Ag alloy

Effect of multiple forging on the microstructure and properties of an as-cast Cu–Ni–Si alloy with high Ni and Si contents

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