J Mater Sci: Mater Electron
 2017
DOI: 10.1007/s10854-017-6413-9
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Microstructure evolution and shear behavior of Au–Sn/Ni–xCo (x = 20, 40, 60, and 80 at.%) joints soldered at 350 °C

Jian Peng
1
,
R. C. Wang
2
,
Mian Wang
3
et al.
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