Microstructure evolution of cast Al-Si-Cu alloys in solution treatment

Abstract

To develop a software to predict the evolution of microstructure and the development of mechanical properties during the heat treatment of cast aluminum alloys, we modeled the redistribution of solute during the solution treatment of multicomponent alloys. The predictions of solidifi cation simulation software or the results of experiment provided the initial microstructure and solute distribution for simulation of heat treatment. Binary through quinary aluminum alloys with silicon, copper, magnesium, and iron were modeled. The basic model assumed local equilibrium (no undercooling due to nucleation or growth) and computed diffusion in the solid constituents during solidification. The evolution of microstructure during solution treatment was followed by qualitative and quantitative metallography. The results of simulation for the ternary alloy Al-7%Si-3.5%Cu were compared to experimental observation.

Microstructure and Properties of 6061 Aluminum Alloy Superficially Modified by Electron Beam Alloying with 1Cr13 Stainless Steel

“…Traditional aluminum surface strengthening methods mainly include: anodic oxidation, thermal spraying, physical / chemical vapor deposition, electroplating and micro-arc oxidation method, and so on. These methods improve the surface properties of aluminum alloy to some extent [4][5][6][7][8][9]. However, the reinforcing layer obtained by these methods is thin (only a few hundred microns), and the bonding interface between reinforcing layer and the substrate is a mechanical interface or diffusion bonding, which the bonding strength is relatively row and it is prone to cracking and falling [3].…”

Effect of T6 Heat Treatment on Dry Sliding Frictional Wear Characteristics of Al-20Si-5Cu Alloy

“…The new phase of Al 2 Cu can not only reduce the solid-liquid interface, but also improve the strength and wear resistance of the materials [5]. Because of the addition of Cu, the alloy becomes can be heat treated [6][7][8]. But silicon content is very low in the previous study.…”