Microstructure evolution of electroless Ni–P and Ni–Cu–P deposits on Cu in the presence of additives

Electromagnetic shielding and corrosion resistance of electroless Ni-P and Ni-P-Cu coatings on polymer/carbon fiber composites

“…The diffraction spectra of coatings obtained when Cu 2+ concentration is equal or less than 0.2 g/L exhibited only a single broad peak centered at 2 θ of 44.5°, corresponding to Ni (111) phase. This indicates the amorphous nature of the coatings, which is in correspondence with the previous reports that the electroless Ni‐P coating would become amorphous when its P% is above 7 wt%. It is also seen that the single peak became slightly broader with the increase of Cu 2+ concentration, probably due to the inhibiting effect of the Cu 2+ during the coating deposition as discussed above.…”

Binary Ni–P bulk amorphous glass prepared by electrodeposition method

“…Ni-P alloys are of great commercial interest [9], when applied over various substrates, take diamond particles and aluminium alloys for example, the corrosion resistance, tribological properties and hardness can be improved [10,11]. Recently, much more attention has been paid to the characteristics of amorphous Ni-P alloys as catalysts and potential materials for making ohmic contact with III-V devices [12][13][14]. Till now, many transition elements-metalloid can be co-deposited to obtain amorphous films but with the increase of plating time, the main defect in the deposited-layer is splitting, separating from the substrate and falling off, therefore, by traditional electrochemical method, the thickness of non-crystalline layer is less than 100 lm.…”

Influence of solution acidity on composition, structure and electrical parameters of Ni‐P alloys

“…The reaction reversibility significantly increases the duration of technological process, particularly when low‐resistance layers characterised by sheet resistance of the order of 0.5 Ω/□ are made. However, those layers have to be produced in a strongly acidic technological bath, because under these conditions, the Ni‐P alloy is characterised by a relatively high‐phosphorus content (>15 at%) (Lin and Chang, 2001), that enables stabilisation of amorphous structure in the process of thermal stabilisation of these layers, taking place at T = 180°C, hence rapid increase of the through‐casing resistivity (TCR) of this alloy does not occur. In order to maintain a relatively high‐reaction rate (of the order of 10 μ g/cm 2 min Ni‐P), which corresponds to a layer thickness of the order of 2 μ /h, the process is conducted at a temperature close to the boiling point of the technological solution (95‐98°C) that gives a chance to obtain a layer characterised by sheet resistance of the order of 0.12‐0.5 Ω/□ and a TCR of the order of 0‐10 ppm/K while maintaining high‐phosphorus concentration in excess of 15 at% (Keong et al , 2002).…”