Microstructure evolution of gold thin films under spherical indentation for micro switch contact applications

Arrazat, Brice; Mandrillon, Vincent; Inal, Karim; Vincent, Maxime; Poulain, Christophe

doi:10.1007/s10853-011-5575-8

Cited by 11 publications

(10 citation statements)

References 11 publications

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“…This catalytic behavior would be ideal to prevent the accumulation of carbon on the surface of electrical contacts, thus increasing the lifetime of the contacts. Simulated contact pairs [17], [26] where one contact is RuO2 have been demonstrated to a limited number of cycles with promising results [38].…”

mentioning

confidence: 99%

RF MEMS Switches With $\hbox{RuO}_{2}$ –$\hbox{Au}$ Contacts Cycled to 10 Billion Cycles

Czaplewski

Nordquist

Patrizi

et al. 2013

J. Microelectromech. Syst.

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We present improvements in RF microelectromechanical switch design and fabrication that demonstrated improved lifetimes in cycled switches. First, implementation of RuO 2 -Au contact metallurgy into an existing design showed improved switch lifetime over switches with Pt-Au, Ir-Au, and Au-Au contacts. Second, the switch design was changed to reduce impact upon switch closure, and the fabrication process was changed to avoid the use of polymer sacrificial materials while including the RuO 2 -Au contact metallurgy. Switches with the new design were cycled to 10 billion cycles with a resistance less than 4 Ω, an insertion loss of 0.4 dB, and an isolation of 28.0 dB at 10 GHz. We propose that the catalytic behavior of the RuO 2 film prevents or delays the failure of the switches due to accumulation of carbon at the contacts. Additionally, the reduced impact upon closure prevented significant contact evolution during cycling.

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mentioning

confidence: 99%

RF MEMS Switches With $\hbox{RuO}_{2}$ –$\hbox{Au}$ Contacts Cycled to 10 Billion Cycles

Czaplewski

Nordquist

Patrizi

et al. 2013

J. Microelectromech. Syst.

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“…This relevant approach can be used for cyclic thermal loading, for diverse materials under micron scale. A microstructural analysis using electron backscattered diffraction [16] and in operando SEM observation [17] could also been performed on this sensor to identify the failure mechanisms.…”

Section: Discussionmentioning

confidence: 99%

“…B. From electrical measurement, the global temperature of the sensor is calculated with Senturia's model [16]. This identified temperature is used to determine the coefficient of thermal expansion by fitting the displacement of the flexible beam (FEM structural mechanics and thermal expansions modules).…”

Section: Thermo-mechanical Propertiesmentioning

confidence: 99%

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Determination of material properties and failure using in-situ thermo-mechanical probe

Arrazat

Orellana

Rivero

et al. 2014

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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International audienceA metallic in-situ stress sensor is modified to address electrical polarization and thus to locally heat this sensor by Joule effect. By coupling SEM electrical nano-probing with analytical modeling and multiphysics Finite Element Method (FEM), the thermo-mechanical properties are identified. As a result, a tensile stress state of 190 MPa, coefficient of thermal expansion of 22.5×10-6 K-1 and thermal conductivity of 190 W/(K·m) are identified in the aluminum thin film in agreement with literature. Moreover, high current induces irreversible deformation and breaking. Using multiphysics FE model with identified thermo-mechanical properties, the failure of the sensor under electrical solicitation is investigated. The evolution of local temperature and mechanical deformation on different sensor designs allows the determination of the breaking location and condition

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“…Since the first publication on ohmic MEMS switch [2], gold contact material is diagnosed as main failure reason due to its low hardness [3,4]. Thus several studies are dedicated to the optimization of the contact material.…”

Section: Introductionmentioning

confidence: 99%

Investigation of boron and nitrogen ion beam implantation in gold thin films for ohmic MEMS switch contact improvement

Arrazat

Inal

Gergaud

2013

2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems

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Microstructure evolution of gold thin films under spherical indentation for micro switch contact applications

Cited by 11 publications

References 11 publications

RF MEMS Switches With $\hbox{RuO}_{2}$ –$\hbox{Au}$ Contacts Cycled to 10 Billion Cycles

RF MEMS Switches With $\hbox{RuO}_{2}$ –$\hbox{Au}$ Contacts Cycled to 10 Billion Cycles

Determination of material properties and failure using in-situ thermo-mechanical probe

Investigation of boron and nitrogen ion beam implantation in gold thin films for ohmic MEMS switch contact improvement

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