Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

“…Additionally, the size of Ag 3 Sn also reduced due to the addition of FNSs, as shown in Figure 14. [55] Wettability increases first and then decreases with the increase of addition ranged from 0 to 1 wt% 0.4 wt% Sn-Ag-Cu-La 2 O 3 [56] Spreading area increases with the addition range from 0 to 0.05% La 2 O 3 , then decreases in 0.1 wt% La 2 O 3 0.05 wt% Sn-Ag-Cu-CuZnAl [70,71] Spreading ratio improvement and contact angle decreased due to the addition of CuZnAl particles 0.5 wt% Sn-Ag-Cu-TiC [30] Contact angles of composite solder reduced first and then improved with the increase of TiC content 0.1 wt% Sn-Ag-Cu-nano-Al [69] Wetting area increases with the improvement of Al nanoparticles when the content is less than 0.1 wt%, and then the wettability deteriorates with the increase of Al nanoparticles when the content is more than 0.1 wt% 0.1 wt% Sn-Ag-Cu-GNPs [39] Spreading ratio improves gradually with the increase of GNPs and achieved an optimum value with the content of 0.05 wt%, then deteriorated in 0.1 wt% addition 0.05 wt% Sn-Ag-Cu-FNSs [41] Contact angle decreased first then decreased with the increase of FNSs content 0.1 wt% 6 Journal of Nanomaterials components [65,[87][88][89]. Consequently, the reliability of the package structure in the service conditions was determined by the mechanical properties of solder joints.…”