2020
DOI: 10.1016/j.jmst.2019.11.015
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Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding

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Cited by 66 publications
(7 citation statements)
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“…Figure 7 shows that increasing the temperature leads to the formation of fine grains. Elongated grains can be seen in Figure 7 a, passing with DRX at grain boundaries in Figure 7 b and, finally, complete DRX and the growth of fine grains, as in Figure 7 c. The effect of temperature on different alloys has been noticed with the same findings, such as nickel [ 154 , 155 ], Al-Cu-Mg [ 156 ], titanium [ 157 ] Ni-Co [ 158 ], and aluminum [ 159 ] alloys.…”
Section: Flow Stress Behaviormentioning
confidence: 59%
“…Figure 7 shows that increasing the temperature leads to the formation of fine grains. Elongated grains can be seen in Figure 7 a, passing with DRX at grain boundaries in Figure 7 b and, finally, complete DRX and the growth of fine grains, as in Figure 7 c. The effect of temperature on different alloys has been noticed with the same findings, such as nickel [ 154 , 155 ], Al-Cu-Mg [ 156 ], titanium [ 157 ] Ni-Co [ 158 ], and aluminum [ 159 ] alloys.…”
Section: Flow Stress Behaviormentioning
confidence: 59%
“…Tang等 [64] , 研究人员在此基础上对纯铜热变形连接界面的 结合组织进行了表征. 研究表明 [65] , 在热变形连接过程 中, 界面区首先发生动态再结晶形核 (图2(a) [68] ; 而在较低温度变形时, 界面组织 愈合过程则与亚晶粒的演化相关 [69] . 图 2 不同合金体系热变形连接界面动态再结晶演化机制.…”
Section: 的快速成型 而且由于每次增加的材料在成分、组织unclassified
“…In this study, the bonding process of bimetals is more similar to that of hot compression bonding technology. 1721 Xie et al 22,23 studied the interface healing mechanism of the hot compression bonding 316LN stainless steel joint and pointed out that the dissolution of oxides at the interface at a higher holding temperature could promote the interface bonding. Sun et al 24 used hot-compression bonding technology to manufacture blanks with uniform composition and carried out a series of hot working on the blank to manufacture an integral support ring (φ15.6 m).…”
Section: Introductionmentioning
confidence: 99%
“…In this study, the bonding process of bimetals is more similar to that of hot compression bonding technology. [17][18][19][20][21] Xie et al 22,23 studied the interface healing mechanism of the hot compression bonding 316LN stainless steel joint and pointed out that the dissolution of oxides at the interface Shanxi Key Laboratory of Metal Forming Theory and Technology, Taiyuan University of Science and Technology, Taiyuan, People's Republic of China Corresponding author: Zhenjiang Li, Shanxi Key Laboratory of Metal Forming Theory and Technology, Taiyuan University of Science and Technology, Taiyuan 030024, Shanxi, People's Republic of China. Email: lizj@tyust.edu.cn at a higher holding temperature could promote the interface bonding.…”
Section: Introductionmentioning
confidence: 99%